LTC2351-14
16
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APPLICATIONS INFORMATION
POWER-DOWN MODES
Upon power-up, the LTC2351-14 is initialized to the
active state and is ready for conversion. The nap and sleep
mode waveforms show the power down modes for the
LTC2351-14. The SCK and CONV inputs control the power
down modes (see Timing Diagrams). Two rising edges at
CONV, without any intervening rising edges at SCK, put
the LTC2351-14 in nap mode and the power consumption
drops from 16.5mW to 4.5mW. The internal reference
remains powered in nap mode. One or more rising edges
at SCK wake up the LTC2351-14 very quickly and CONV
can start an accurate conversion within a clock cycle.
Four rising edges at CONV, without any intervening rising
edges at SCK, put the LTC2351-14 in sleep mode and the
power consumption drops from 16.5mW to 12μW. One
or more rising edges at SCK wake up the LTC2351-14 for
operation. The internal reference (V
REF
) takes 2ms to
slew and settle with a 10μF load. Using sleep mode more
frequently compromises the accuracy of the output data.
Note that for slower conversion rates, the nap and sleep
modes can be used for substantial reductions in power
consumption.
DIGITAL INTERFACE
The LTC2351-14 has a 3-wire SPI (serial peripheral
interface). The SCK and CONV inputs and SDO output
implement this interface. The SCK and CONV inputs
accept swings from 3V logic and are TTL compatible, if the
logic swing does not exceed V
DD
. A detailed description
of the three serial port signals follows:
Conversion Start Input (CONV)
The rising edge of CONV starts a conversion, but subse-
quent rising edges at CONV are ignored by the LTC2351-14
until the following 96 SCK rising edges have occurred. The
duty cycle of CONV can be arbitrarily chosen to be used as
a frame sync signal for the processor serial port. A simple
approach to generate CONV is to create a pulse that is one
SCK wide to drive the LTC2351-14 and then buffer this
signal to drive the frame sync input of the processor serial
port. It is good practice to drive the LTC2351-14 CONV
input fi rst to avoid digital noise interference during the
sample-to-hold transition triggered by CONV at the start
of conversion. It is also good practice to keep the width
of the low portion of the CONV signal greater than 15ns
to avoid introducing glitches in the front end of the ADC
just before the sample-and-hold goes into hold mode at
the rising edge of CONV.
Minimizing Jitter on the CONV Input
In high speed applications where high amplitude sine waves
above 100kHz are sampled, the CONV signal must have
as little jitter as possible (10ps or less). The square wave
output of a common crystal clock module usually meets
this requirement. The challenge is to generate a CONV
signal from this crystal clock without jitter corruption from
other digital circuits in the system. A clock divider and
any gates in the signal path from the crystal clock to the
CONV input should not share the same integrated circuit
with other parts of the system. The SCK and CONV inputs
should be driven fi rst, with digital buffers used to drive
the serial port interface. Also note that the master clock
in the DSP may already be corrupted with jitter, even if it
comes directly from the DSP crystal. Another problem with
high speed processor clocks is that they often use a low
cost, low speed crystal (i.e., 10MHz) to generate a fast,
but jittery, phase-locked loop system clock (i.e., 40MHz).
The jitter in these PLL-generated high speed clocks can be
several nanoseconds. Note that if you choose to use the
frame sync signal generated by the DSP port, this signal
will have the same jitter of the DSPs master clock.
The Typical Application on the last page of this datasheet
shows a circuit for level shifting and squaring the output
from an RF signal generator or other low jitter source. A
single D-type fl ip-fl op is used to generate the CONV signal
to the LTC2351-14. Re-timing the master clock signal
eliminates clock jitter introduced by the controlling device
(DSP, FPGA, etc.) Both the inverter and fl ip-fl op must be
treated as analog components and should be powered
from a clean analog supply.
Serial Clock Input (SCK)
The rising edge of SCK advances the conversion process
and also udpates each bit in the SDO data stream. After
CONV rises, the third rising edge of SCK sends out up to
six sets of 14 data bits, with the MSB sent fi rst. A simple
approach is to generate SCK to drive the LTC2351-14 fi rst
LTC2351-14
17
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APPLICATIONS INFORMATION
and then buffer this signal with the appropriate number of
inverters to drive the serial clock input of the processor
serial port. Use the falling edge of the clock to latch data
from the serial data output (SDO) into your processor
serial port. The 14-bit serial data will be received in six
16-bit words with 96 or more clocks per frame sync. If
fewer than six channels are selected by SEL0–SEL2 for
conversion, then 16 clocks are needed per channel to
convert the analog inputs and read out the resulting data
after the next convert pulse. It is good practice to drive the
LTC2351-14 SCK input fi rst to avoid digital noise interfer-
ence during the internal bit comparison decision by the
internal high speed comparator. Unlike the CONV input,
the SCK input is not sensitive to jitter because the input
signal is already sampled and held constant.
Serial Data Output (SDO)
Upon power-up, the SDO output is automatically reset to
the high impedance state. The SDO output remains in high
impedance until a new conversion is started. SDO sends out
up to six sets of 14 bits in the output data stream after the
third rising edge of SCK after the start of conversion with
the rising edge of CONV. The six, or fewer, 14-bit words are
separated by two don’t care bits and two clock cycles in
high impedance mode. Please note the delay specifi cation
from SCK to a valid SDO. SDO is always guaranteed to
be valid by the next rising edge of SCK. The 16- to 96-bit
output data stream is compatible with the 16-bit or 32-bit
serial port of most processors.
BOARD LAYOUT AND BYPASSING
Wire wrap boards are not recommended for high resolu-
tion and/or high speed A/D converters. To obtain the best
performance from the LTC2351-14, a printed circuit board
with ground plane is required. Layout for the printed circuit
board should ensure that digital and analog signal lines
are separated as much as possible. In particular, care
should be taken not to run any digital track alongside an
analog signal track. If optimum phase match between the
inputs is desired, the length of the twelve input wires of
the six input channels should be kept matched. But each
pair of input wires to the six input channels should be
kept separated by a ground trace to avoid high frequency
crosstalk between channels.
High quality tantalum and ceramic bypass capacitors
should be used at the V
CC
, V
DD
and V
REF
pins, as shown
in the Block Diagram on the fi rst page of this data sheet.
For optimum performance, a 10μF surface mount tantalum
capacitor with a 0.1μF ceramic is recommended for the
V
CC
, V
DD
and V
REF
pins. Alternatively, 10μF ceramic chip
capacitors such as X5R or X7R may be used. The capaci-
tors must be located as close to the pins as possible. The
traces connecting the pins and the bypass capacitors must
be kept short and should be made as wide as possible. The
V
CC
and V
DD
bypass capacitor returns to the ground plane
and the V
REF
bypass capacitor returns to the Pin 22. Care
should be taken to place the 0.1μF V
CC
and V
DD
bypass
capacitor as close to Pins 24 and 25 as possible.
Figure 6 shows the recommended system ground connec-
tions. All analog circuitry grounds should be terminated at
the LTC2351-14 Exposed Pad. The ground return from the
LTC2351-14 to the power supply should be low impedance
for noise-free operation. The Exposed Pad of the 32-pin
QFN package is also internally tied to the ground pads.
The Exposed Pad should be soldered on the PC board to
reduce ground connection inductance. All ground pins
(GND, DGND, OGND) must be connected directly to the
same ground plane under the LTC2351-14.
V
DD
BYPASS,
0.1μF, 0402
OV
DD
BYPASS,
0.1μF, 0402
V
REF
BYPASS,
10μF, 0805
V
CC
BYPASS,
0.1μF, 0402 AND
10μF, 0805
235114 F06
Figure 6. Recommended Layout
LTC2351-14
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235114 F07
3
30
32
1
2
3-WIRE SERIAL
INTERFACE LINK
OV
DD
CONV
SCK
LTC2351-14
SDO
V
CC
BFSR
BCLKR
TMS320C54x
BDR
OGND
31
DGND
CONV
0V TO 3V LOGIC SWING
CLK
5V3V
B13 B12
APPLICATIONS INFORMATION
HARDWARE INTERFACE TO TMS320C54x
The LTC2351-14 is a serial output ADC whose interface
has been designed for high speed buffered serial ports in
fast digital signal processors (DSPs). Figure 7 shows an
example of this interface using a TMS320C54X.
The buffered serial port in the TMS320C54x has direct
access to a 2kB segment of memory. The ADC’s serial
data can be collected in two alternating 1kB segments,
in real time, at the full 1.5Msps conversion rate of the
LTC2351-14. The DSP assembly code sets frame sync
mode at the BFSR pin to accept an external positive going
pulse and the serial clock at the BCLKR pin to accept an
external positive edge clock. Buffers near the LTC2351-14
may be added to drive long tracks to the DSP to prevent
corruption of the signal to LTC2351-14. This confi guration
is adequate to traverse a typical system board, but source
resistors at the buffer outputs and termination resistors
at the DSP, may be needed to match the characteristic
impedance of very long transmission lines. If you need
to terminate the SDO transmission line, buffer it fi rst with
one or two 74ACxx gates. The TTL threshold inputs of the
DSP port respond properly to the 3V swing used with the
LTC2351-14.
Figure 7. DSP Serial Interface to TMS320C54x

LTC2351IUH-14#TRPBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC 14-Bit, 6-Channel 1.5Msps simultaneous Sampling ADC
Lifecycle:
New from this manufacturer.
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