HDAF-11-08.0-S-13-2

DO NOT
SCALE FROM
THIS PRINT
HDAF-XX-XX.X-X-13-X-X
No OF POSITIONS
(13 ROWS PER POSITION)
-11
-15
-23
SOLDER CHARGE MATERIAL
-1: 63% TIN / 37% LEAD
-2: 95.5% TIN / 3.8% SILVER
0.7% COPPER (LEAD FREE)
LEAD STYLE
-08.0: 8MM
-18.0: 18MM
PLATING SPECIFICATION
-S: SELECTIVE, .000030 INCHES GOLD IN MATING AREA,
MATTE TIN ON TAIL AND WELD TABS
OPTION
-P: PICK & PLACE PAD
(USE MPP-26-01-N)
-13
No OF ROWS
C
"D" (REF)
13.00 .512
(REF)
1.65
(REF)
.065
1.20
(REF)
.047
1.15 .045
(REF)
"A"
"A"
FIG 1
-11: 11 POSITION
(HDAF-11-08.0-X-13-X-X SHOWN)
(SOME WAFERS NOT SHOWN FOR CLARITY)
SUB-IM-C-207-XX.X-S-X
C
C
"F"(REF)
"A"
2.00 .079
(TYP) (REF)
2.85 .112
(REF)
3.60 .142
(2 PLCS)
(REF)
"G"
"B"
"A"
6.15 .242
C
L
C
L
WT-23-XX.X-T
HDAF-XX-XX.X
C
L
C
L
C
L
C
L
"E" (REF)
1.60
(REF)
.063
3.25
(REF)
.128
22.50
(REF)
.886
"C" (REF)
PIN 1A
PIN 1M
PIN 11M
PIN 11A
0.70 .028
(REF)
2.30 .091
13.70 .539
(SEE NOTE 4)
14.40 [.567]
12 EQ. SPACES
@ 1.2mm =
SECTION "A"-"A"
(-18.0 SHOWN)
(-08.0 SHOWN)
C
C
C
C
C
DESIGNED & DIMENSIONED
IN MILLIMETERS
(INCHES FOR REFERENCE ONLY)
C
C
L
C
L
C
L
C
L
C
L
SHEET OF
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN
MILLIMETERS [INCHES].
TOLERANCES ARE:
DECIMALS ANGLES
.X:
0.3 [.01] 2
.XX:
0.13 [.005]
.XXX:
0.051 [.0020]
MATERIAL:
2.0MM PITCH HD ARRAY SOCKET ASSEMBLY
BY:
HDAF-XX-XX.X-X-13-X-X
DWG. NO.
DESCRIPTION:
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
DO NOT SCALE DRAWING
D KNOWLDEN
7/14/2005
2
1
SHEET SCALE: 1.5:1
INSULATOR: LCP COLOR: BLACK
CONTACT: COPPER ALLOY
WAFER MATERIAL: LCP, COLOR: BLACK
PICK AND PLACE PAD: COPPER ALLOY
WELD TAB: BRASS
F:\DWG\MISC\MKTG\HDAF-XX-XX.X-X-13-X-X-MKT.SLDDRW
NOTES:
1. REPRESENTS A CRITICAL DIMENSION.
2. MINIMUM PUSHOUT FORCE: 2.22N[.5 LB]. FOR
WAFERS AND WELD TABS.
3. CONNECTORS TO BE PACKAGED IN TRAYS.
4. DIMENSION FROM
C
L
OF END TAIL TO
C
L
OF -A PIN.
C
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733 FAX: 812-948-5047
e-Mail: info@SAMTEC.com code: 55322
REVISION C
25.15 .990
(REF)
16.70
(REF)
.657
13.50
(REF)
.531
"B""B"
AREA AVAILABLE
FOR VACUUM PICKUP
MPP-26-01-N
1.61 .063
OF CONTACT)
"G"
0.08
(TO BOTTOM
0.60
(REF)
.024
1.92 .075
(REF)
0.10 .004
(BOTTOM OF CONTACT
TO BOTTOM OF SOLDER
CHARGE)
2.00
(TYP)
.079
2.00 .079
C
L
C
L
WT-23-XX.X-T
SOLDER CHARGE (TYP)
C
0.15 [.006]
("G" + 0.35)
FIG 2
-15: 15 POSITION
(HDAF-15-08.0-X-13-X-P SHOWN)
(SOME WAFERS NOT SHOWN FOR CLARITY)
C
VIEW "B"-"B"
SCALE 4:1
C
C
SHEET OF
2.0MM PITCH HD ARRAY SOCKET ASSEMBLY
BY:
HDAF-XX-XX.X-X-13-X-X
DWG. NO.
DESCRIPTION:
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
DO NOT SCALE DRAWING
D KNOWLDEN
7/14/2005
2
2
SHEET SCALE: 1:1
REVISION C
F:\DWG\MISC\MKTG\HDAF-XX-XX.X-X-13-X-X-MKT.SLDDRW
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733 FAX: 812-948-5047
e-Mail: info@SAMTEC.com code: 55322

HDAF-11-08.0-S-13-2

Mfr. #:
Manufacturer:
Samtec
Description:
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Socket
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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