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INMP441ACEZ-R7

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21
INMP441
SUPPORTING DOCUMENTS
For additional information, see the following documents.
EVALUATION BOARD USER GUIDE
UG-303, EV_INMP441Z-FX: Bottom Port I
2
S Output MEMS Microphone Evaluation Board
UG-362, EV_INMP441Z SDP Daughter Board for the INMP441 I
2
S MEMS Microphone
APPLICATION NOTES (PRODUCT SPECIFIC)
AN-0208, High Performance Digital MEMS Microphone’s Simple Interface to SigmaDSP Audio Processor
AN-0266, High Performance Digital MEMS Microphone Standard Digital Audio Interface to Blackfin DSP
APPLICATION NOTES (GENERAL)
AN-1003, Recommendations for Mounting and Connecting the Invensense, Inc., Bottom-Ported MEMS Microphones
AN-1068, Reflow Soldering of the MEMS Microphone
AN-1112, Microphone Specifications Explained
AN-1124, Recommendations for Sealing Invensense, Inc., Bottom-Port MEMS Microphones from Dust and Liquid Ingress
AN-1140, Microphone Array Beamforming
Page 16 of 21
Document Number: DS-INMP441-00
Revision: 1.1
INMP441
PCB DESIGN AND LAND PATTERN LAYOUT
Lay out the PCB land pattern for the INMP441 at a 1:1 ratio to the solder pads on the microphone package (see Figure 14.) Take care
to avoid applying solder paste to the sound hole in the PCB. Figure 15 shows a suggested solder paste stencil pattern layout.
The response of the INMP441 is not affected by the PCB hole size, as long as the hole is not smaller than the sound port of the micro-
phone (0.25 mm, or 0.010 inch, in diameter). A 0.5 mm to 1 mm (0.020 inch to 0.040 inch) diameter for the hole is recommended.
Align the hole in the microphone package with the hole in the PCB. The exact degree of the alignment does not affect the
performance of the microphone as long as the holes are not partially or completely blocked.
Figure 14. Suggested PCB Land Pattern Layout
Figure 15. Suggested Solder Paste Stencil Pattern Layout
DIMENSIONS SHOWN IN MILLIMETERS
1.33 (2×)
2.66 (4×)
0.40 × 0.60
(8×)
0.96
1.56
3.16
1.05
(6×)
0.25 DIA.
(THRU HOLE)
DIMENSIONS SHOWN IN MILLIMETERS
1.33 (2×)
3.76
0.20
2.66 (4×)
0.350 × 0.550
(8×)
1.6
4.72
1.07
1.05
(6×)
1.05
Page 17 of 21
Document Number: DS-INMP441-00
Revision: 1.1
INMP441
PCB MATERIAL AND THICKNESS
The performance of the INMP441 is not affected by PCB thickness. The INMP441 can be mounted on either a rigid or flexible PCB. A
flexible PCB with the microphone can be attached directly to the device housing with an adhesive layer. This mounting method
offers a reliable seal around the sound port while providing the shortest acoustic path for good sound quality.
HANDLING INSTRUCTIONS
PICK AND PLACE EQUIPMENT
The MEMS microphone can be handled using standard pick-and-place and chip shooting equipment. Take care to avoid damage to the
MEMS microphone structure as follows:
• Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the
pickup tool can make contact with any part of the lid surface.
• Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone.
Do not pull air out of or blow air into the microphone port.
• Do not use excessive force to place the microphone on the PCB.
REFLOW SOLDER
For best results, the soldering profile must be in accordance with the recommendations of the manufacturer of the solder paste used to
attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified
in Figure 2 and Table 5.
BOARD WASH
When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow-off procedures or
ultrasonic cleaning.
Page 18 of 21
Document Number: DS-INMP441-00
Revision: 1.1
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21

INMP441ACEZ-R7

Mfr. #:
Buy INMP441ACEZ-R7
Manufacturer:
TDK InvenSense
Description:
MEMS Microphones Omnidirectional Microphone with Bottom Port and I S Digital Output
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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