MKT469
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Vishay BCcomponents
End of Life September 2018 - Alternative Device: MKT467, MKT468
Revision: 27-Mar-18
9
Document Number: 28244
For technical questions, contact: dc-film@vishay.com
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POWER DISSIPATION AND MAXIMUM COMPONENT TEMPERATURE RISE
The power dissipation must be limited in order not to exceed the maximum allowed component temperature rise as a function
of the free ambient temperature.
The power dissipation can be calculated according type detail specification “HQN-384-01/101: Technical Information Film
Capacitors”.
The component temperature rise (T) can be measured (see section “Measuring the component temperature” for more details)
or calculated by T = P/G:
• T = component temperature rise (°C)
• P = power dissipation of the component (mW)
• G = heat conductivity of the component (mW/°C)
HEAT CONDUCTIVITY (G) AS A FUNCTION OF (ORIGINAL) PITCH AND CAPACITOR BODY
THICKNESS IN mW/°C
W
max.
(mm)
HEAT CONDUCTIVITY (mW/°C)
PITCH 10 mm PITCH 15.5 mm PITCH 22.5 mm PITCH 27.5 mm
4.0 4.0 5.0 - -
4.5 4.5 6.0 - -
5.0 5.0 6.0 12.0 13.0
5.5 6.0 6.5 13.0 15.0
6.0 6.0 6.5 13.0 15.0
6.5 6.5 8.0 15.0 17.0
7.0 - 8.0 15.0 17.0
7.5 - 9.0 17.0 18.0
8.0 - 9.0 17.0 20.0
8.5 - 11.0 18.0 20.0
9.0 - 11.0 18.0 22.0
9.5 - 12.0 20.0 22.0
10.0 - 12.0 20.0 23.0
10.5 - - 22.0 25.0
11.0 - - - 25.0
11.5 - - - 27.0
12.0 - - - 27.0
12.5 - - - 30.0
13.0 - - - 30.0
13.5 - - - 30.0
14.0 - - - 30.0
14.5 - - - 33.0
15.0 - - - 33.0
15.5 - - - 37.0
16.0 - - - 37.0