SUM110P06-07L-E3

SUM110P06-07L
www.vishay.com
Vishay Siliconix
S15-1278-Rev. D, 08-Jun-15
1
Document Number: 72439
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
P-Channel 60 V (D-S) 175 °C MOSFET
Ordering Information:
SUM110P06-07L-E3 (Lead (Pb)-free)
FEATURES
TrenchFET
®
power MOSFET
Package with low thermal resistance
Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
Notes
a. Duty cycle 1 %.
b. When mounted on 1" square PCB (FR4 material).
c. See SOA curve for voltage derating.
d. Limited by package.
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)I
D
(A)
d
-60
0.0069 at V
GS
= -10 V
-110
0.0088 at V
GS
= -4.5 V
S
G
D
P-Channel MOSFET
TO-263
Top View
G
D
S
G
D
S
ABSOLUTE MAXIMUM RATINGS (T
C
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage V
DS
-60
V
Gate-Source Voltage V
GS
± 20
Continuous Drain Current
d
(T
J
= 175 °C)
T
C
= 25 °C
I
D
-110
A
T
C
= 125 °C -95
Pulsed Drain Current I
DM
-240
Avalanche Current
L = 0.1 mH
I
AS
-75
Single Pulse Avalanche Energy
a
E
AS
281 mJ
Power Dissipation
T
C
= 25 °C
c
P
D
375
W
T
A
= 25 °C
b
3.75
Operating Junction and Storage Temperature Range T
J
, T
stg
-55 to +175 °C
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL TYPICAL UNIT
Junction-to-Ambient PCB mount
b
R
thJA
40
°C/W
Junction-to-Case R
thJC
0.4
SUM110P06-07L
www.vishay.com
Vishay Siliconix
S15-1278-Rev. D, 08-Jun-15
2
Document Number: 72439
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Notes
a. Pulse test; pulse width 300 μs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS (T
J
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-Source Breakdown Voltage V
DS
V
GS
= 0 V, I
D
= -250 μA -60 - -
V
Gate Threshold Voltage V
GS(th)
V
DS
= V
GS
, I
D
= -250 μA -1 - -3
Gate-Body Leakage I
GSS
V
DS
= 0 V, V
GS
= ± 20 V - - ± 100 nA
Zero Gate Voltage Drain Current I
DSS
V
DS
= -60 V, V
GS
= 0 V - - -1
μAV
DS
= -60 V, V
GS
= 0 V, T
J
= 125 °C - - -50
V
DS
= -60 V, V
GS
= 0 V, T
J
= 175 °C - - -250
On-State Drain Current
a
I
D(on)
V
DS
= -5 V, V
GS
= -10 V -120 - - A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= -10 V, I
D
= -30 A - 0.0055 0.0069
Ω
V
GS
= -10 V, I
D
= -30 A, T
J
= 125 °C - - 0.0115
V
GS
= -10 V, I
D
= -30 A, T
J
= 175 °C - - 0.0138
V
GS
= -4.5 V, I
D
= -20 A - 0.0070 0.0088
Forward Transconductance
a
g
fs
V
DS
= -15 V, I
D
= -50 A 20 - - S
Dynamic
b
Input Capacitance C
iss
V
GS
= 0 V, V
DS
= -25 V, f = 1 MHz
- 11 400 -
pFOutput Capacitance C
oss
- 1200 -
Reverse Transfer Capacitance C
rss
- 900 -
Total Gate Charge
c
Q
g
V
DS
= -30 V, V
GS
= -10 V, I
D
= -110 A
- 230 345
nCGate-Source Charge
c
Q
gs
-50-
Gate-Drain Charge
c
Q
gd
-60-
Gate Resistance R
g
f = 1 MHz - 3 - Ω
Turn-On Delay Time
c
t
d(on)
V
DD
= -30 V, R
L
= 0.27 Ω
I
D
-110 A, V
GEN
= -10 V, R
g
= 1 Ω
-2030
ns
Rise Time
c
t
r
-2540
Turn-Off Delay Time
c
t
d(off)
- 110 200
Fall Time
c
t
f
- 50 100
Drain-Source Body Diode Characteristics (T
C
= 25 °C
b
)
Continuous Current I
S
- - -110
A
Pulsed Current I
SM
- - -240
Forward Voltage
a
V
SD
I
F
= -85 A, V
GS
= 0 V - -1 -1.5 V
Reverse Recovery Time t
rr
I
F
= -85 A, dI/dt = 100 A/μs
- 91 137 ns
Peak Reverse Recovery Charge I
RM(REC)
--6-9A
Reverse Recovery Charge Q
rr
- 0.21 0.44 μC
SUM110P06-07L
www.vishay.com
Vishay Siliconix
S15-1278-Rev. D, 08-Jun-15
3
Document Number: 72439
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Output Characteristics
Transconductance
Capacitance
Transfer Characteristics
On-Resistance vs. Drain Current
Gate Charge
0
40
80
120
160
200
0246810
V
DS
- Drain-to-Source Voltage (V)
- Drain Current (A)
I
D
V
GS
= 10 V thru 5 V
3 V
4 V
0
50
100
150
200
250
0 153045607590
I
D
- Drain Current (A)
- Transconductance (S)
g
fs
125 °C
T
C
= -55 °C
25 °C
0
2000
4000
6000
8000
10 000
12 000
14 000
0 102030405060
V
DS
- Drain-to-Source Voltage (V)
C
- Capacitance (pF)
C
iss
C
oss
C
rss
0
40
80
120
160
200
012345
V
GS
- Gate-to-Source Voltage (V)
-
Drain Current (A)
I
D
25 °C
-55 °C
T
C
= 125 °C
0
4
8
12
16
20
0 50 100 150 200 250 300 350 400 450
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
GS
V
DS
= 30 V
I
D
= 110 A

SUM110P06-07L-E3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET 60V 110A 375W
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet