AD8390A Data Sheet
Rev. C | Page 4 of 12
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Supply Voltage (VCC − VEE) 26 V
VCOM VEE < VCOM < VCC
Package Power Dissipation See Figure 2
Maximum Junction Temperature (T
J
MAX
) 150°C
Operating Temperature Range (T
A
) –40°C to +85°C
Storage Temperature Range –65°C to +150°C
Lead Temperature (Soldering, 10 sec) 300°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
θ
JA
is specified in still air with exposed pad soldered to 4-layer
JEDEC test board. θ
JC
is specified at the exposed pad.
Table 3. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
16-Lead LFCSP (CP-16-23) 30.4 16 °C/W
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the AD8390A is
limited by its junction temperature on the die.
The maximum safe junction temperature of plastic encapsu-
lated devices, as determined by the glass transition temperature
of the plastic, is 150°C. Exceeding this limit temporarily may
cause a shift in the parametric performance due to a change in
the stresses exerted on the die by the package. Exceeding this
limit for an extended period can result in device failure.
Figure 2 shows the maximum safe power dissipation in
the package vs. the ambient temperature. θ
JA
values are
approximations.
AMBIENT TEMPERATURE
(°C)
MAXIMUM POWER DISSIPATION (W)
0
0.5
1.0
1.5
2.0
2.5
3.0
–25
–15
–5
5
15 25 35 45 55 65 75 85
3.5
T
J
= 150°C
07094-003
Figure 2. Maximum Power Dissipation vs. Temperature
The power dissipated in the package (P
D
) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (V
S
) times the
quiescent current (I
S
). Assuming that the load R
L
is referenced
to midsupply, the total drive power is V
S
/2 × I
OUT
, part of which
is dissipated in the package and part in the load (V
OUT
× I
OUT
).
RMS output voltages must be considered. If R
L
is referenced to
VEE as in single-supply operation, the total power is V
S
× I
OUT
.
In single-supply operation with R
L
referenced to VEE, the worst
case is V
OUT
= V
S
/2.
Airflow increases heat dissipation, effectively reducing θ
JA
. In
addition, more copper in direct contact with the package leads
from PCB traces, through holes, ground, and power planes
reduces θ
JA
.
ESD CAUTION
