UCLAMP2511T.TNT

4© 2009 Semtech Corp.
www.semtech.com
PROTECTION PRODUCTS
uClamp2511T
Applications Information
Device Connection Options
The μClamp2511T is designed to protect one data line
operating up to 2.5 volts. It will present a high
impedance to the protected line up to 2.5 volts. It will
“turn on” when the line voltage exceeds 2.7 volts. The
device is bidirectional and may be used on lines where
the signal polarity is above and below ground. These
devices are not recommended for use on DC power
supply lines due to their snap-back voltage
characteristic.
EPD TVS
Characteristics
These devices are constructed using Semtech’s
proprietary EPD technology. The structure of the EPD
TVS is vastly different from the traditional pn-junction
devices. At voltages below 5V, high leakage current
and junction capacitance render conventional ava-
lanche technology impractical for most applications.
However, by utilizing the EPD technology, these devices
can effectively operate at 2.5V while maintaining
excellent electrical characteristics.
The EPD TVS employs a complex nppn structure in
contrast to the pn structure normally found in tradi-
tional silicon-avalanche TVS diodes. The EPD mecha-
nism is achieved by engineering the center region of
the device such that the reverse biased junction does
not avalanche, but will “punch-through” to a conduct-
ing state. This structure results in a device with supe-
rior DC electrical parameters at low voltages while
maintaining the capability to absorb high transient
currents.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
z Place the TVS near the input terminals or connec-
tors to restrict transient coupling.
z Minimize the path length between the TVS and the
protected line.
z Minimize all conductive loops including power and
ground loops.
z The ESD transient return path to ground should be
kept as short as possible.
z Never run critical signals near board edges.
z Use ground planes whenever possible.
Device Schematic & Pin Configuration
5© 2009 Semtech Corp.
www.semtech.com
PROTECTION PRODUCTS
uClamp2511T
Spice Model
Applications Information - Spice Model
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VBIpmA3-E13-E1
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6© 2009 Semtech Corp.
www.semtech.com
PROTECTION PRODUCTS
uClamp2511T
Outline Drawing - SLP1006P2T
Land Pattern - SLP1006P2T
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
NOTES:
2.
DIM
Y
G
C
MILLIMETERSINCHES
(0.85)
.055
.012
.022
(.033)
1.40
0.55
0.30
DIMENSIONS
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
Z
Y
(C)
G
Z
X .024 0.60
X
1.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
bxN
e
A1
.000
.001 .002
0.00
0.03 0.05
R
2x L
PIN 1 ID
R .002 .004 .006 0.05
0.10
0.15
A
INCHES
.026 BSC
aaa
N
E
L
e
.008
.020
DIM
A
MIN
.018
.015
0.30
0.70
0.20
0.50
.003
2
.010
.024
.012
.028
0.08
2
0.25
0.60
0.65 BSC
MILLIMETERS
MAX
0.55
0.43
DIMENSIONS
MIN
0.45
NOM
.016
.020
MAX
.022
.017
NOM
0.37
0.50
0.40
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
NOTES:
1.
BOTTOM VIEW
TOP VIEW
A
B
C
b
aaa C
SEATING
PLANE
bbb C A B
D
.035 .039 .043 0.90
1.10
1.00
.004bbb 0.10
D
E
A1

UCLAMP2511T.TNT

Mfr. #:
Manufacturer:
Semtech
Description:
TVS Diodes / ESD Suppressors 1-LINE 2.5V 10PF ESD
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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