374124B00035G

DATASHEET
BoardLevelCooling3741
USA:1.855.322.2843 BoardLevelCooling
EUROPE:39.051.764002 www.aavid.com
ASIA:86.21.6115.2000x8122

MECHANICAL&PERFORMANCE
Drawingdimensionsareshowninmm,(in)
BOARDLEVELCOOLING‐3741
3741isaseriesofsquarepinfinboardlevelheatsinksdesignedtocoolBGA
andFPGAdevices.Representativeimageonly.
ORDERINGINFORMATION
PartNumber DeviceType
374124B00035G BGA,FPGA
374124B60023G BGA,FPGA
HEATSINKDETAILS
Property Details
Material Aluminum
Finish BlackAnodize
DeviceAttachmentOptions:
374124B00035G
Tape
DeviceAttachmentOptions:
374124B60023G
SolderAnchorClip
ThermalInterfaceMaterial:
374124B00035G
T411ChomericsTapeforAll
Surfaces
ThermalInterfaceMaterial:
374124B60023G
T766ChomericsPhaseChangefor
AllSurfaces
PartNumber:374124B00035G
Property Details
HeatSinkWidth(mm) 23.00
HeatSinkLength(mm) 23.00
HeatSinkHeight(mm) 18.00
HeatSinkMountingDirection Horizontal,Vertical
DATASHEET
BoardLevelCooling3741
USA:1.855.322.2843 BoardLevelCooling
EUROPE:39.051.764002 www.aavid.com
ASIA:86.21.6115.2000x8122

PartNumber:374124B60023G
MountingDetails:

374124B00035G

Mfr. #:
Manufacturer:
Aavid, Thermal Division of Boyd Corporation
Description:
Heat Sink Passive Pin Array Adhesive 23.4C/W Black Anodized
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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