DATASHEET
BoardLevelCooling–3741
USA:1.855.322.2843 BoardLevelCooling
EUROPE:39.051.764002 www.aavid.com
ASIA:86.21.6115.2000x8122
MECHANICAL&PERFORMANCE
Drawingdimensionsareshowninmm,(in)
BOARDLEVELCOOLING‐3741
3741isaseriesofsquarepinfinboardlevelheatsinksdesignedtocoolBGA
andFPGAdevices.Representativeimageonly.
ORDERINGINFORMATION
PartNumber DeviceType
374124B00035G BGA,FPGA
374124B60023G BGA,FPGA
HEATSINKDETAILS
Property Details
Material Aluminum
Finish BlackAnodize
DeviceAttachmentOptions:
374124B00035G
Tape
DeviceAttachmentOptions:
374124B60023G
SolderAnchorClip
ThermalInterfaceMaterial:
374124B00035G
T411ChomericsTapeforAll
Surfaces
ThermalInterfaceMaterial:
374124B60023G
T766ChomericsPhaseChangefor
AllSurfaces
PartNumber:374124B00035G
Property Details
HeatSinkWidth(mm) 23.00
HeatSinkLength(mm) 23.00
HeatSinkHeight(mm) 18.00
HeatSinkMountingDirection Horizontal,Vertical