MAX4551/MAX4552/MAX4553
±15kV ESD-Protected, Quad,
Low-Voltage, SPST Analog Switches
_______________________________________________________________________________________ 7
Pin Description
10
0.0001
-60 -20-40 20 60 10080
POWER-SUPPLY CURRENT
vs. TEMPERATURE
0.001
0.01
0.1
1
MAX4551-10
TEMPERATURE (°C)
I+, I- (nA)
040
I-
I+
TOTAL HARMONIC DISTORTION
vs. FREQUENCY
MAX4551-11
FREQUENCY (Hz)
THD (%)
1
0.001
0.01
0.1
1 1k 10k 100k10 100 2M
V+ = +5V
V- = -5V
600 IN and OUT
100m 500m
-100
-90
-80
-70
-60
-40
-50
-30
-20
0
-10
100k 1m 10m
FREQUENCY RESPONSE
MAX4551-12
FREQUENCY (Hz)
LOSS (dB)
INSERTION LOSS
OFF-ISOLATION
ON-PHASE
50 IN/OUT
_____________________________Typical Operating Characteristics (continued)
(V+ = +5V, V- = -5V, GND = 0, T
A
= +25°C, unless otherwise noted.)
NAME FUNCTION
1, 16, 9, 8 IN1–IN4 Logic-Control Digital Inputs
2, 15, 10, 7 COM1–COM4 Analog Switch Common* Terminals
PIN
3, 14, 11, 6 NC1–NC4 Analog Switch Normally Closed Terminals
4 V-
Negative Analog Supply-Voltage Input. Connect to GND for single-
supply operation.
1, 16, 9, 8
2, 15, 10, 7
13 V+
Positive Analog and Digital Supply Voltage Input. Internally con-
nected to substrate.
12 N.C. No Connection. Not internally connected.
4
13
12
5
1, 16, 9, 8
2, 15, 10, 7
NO1–NO4
4
13
12
5
MAX4551 MAX4552 MAX4553
5 GND
Ground. Connect to digital ground. (Analog signals have no ground
reference; they are limited to V+ and V-.)
Analog Switch Normally Open Terminals3, 14, 11, 6
NO1, NO4 Analog Switch Normally Open Terminals 3, 6
NC2, NC3 Analog Switch Normally Closed Terminals 14, 11
*NO_ (or NC_) and COM_ pins are identical and interchangeable. Either may be considered as an input or output; signals pass
equally well in either direction.
MAX4551/MAX4552/MAX4553
±15kV ESD-Protected, Quad,
Low-Voltage, SPST Analog Switches
8 _______________________________________________________________________________________
Applications Information
MAX4551/MAX4552/MAX4553
±15kV ESD Protection
The MAX4551/MAX4552/MAX4553 are ±15kV ESD-pro-
tected according to IEC 1000-4-2 at their NC/NO pins.
To accomplish this, bidirectional SCRs are included on-
chip between these pins and the GND pin. In normal
operation, these SCRs are off and have negligible
effect on the performance of the switches. When there
is an ESD strike at these pins, however, the voltages at
these pins go Beyond-the-Rails™ and cause the corre-
sponding SCR(s) to turn on in a few nanoseconds and
bypass the surge safely to ground. This method is
superior to using diode clamps to the supplies because
unless the supplies are very carefully decoupled
through low ESR capacitors, the ESD current through
the diode clamp could cause a significant spike in the
supplies. This may damage or compromise the reliabili-
ty of any other chip powered by those same supplies.
In the MAX4551/MAX4552/MAX4553, there are diodes
to the supplies in addition to the SCRs at the NC/NO
pins, but there is a resistance in series with these
diodes to limit the current into the supplies during an
ESD strike. The diodes are present to protect these
pins from overvoltages that are not as a result of ESD
strikes like those that may occur due to improper
power-supply sequencing.
Once the SCR turns on because of an ESD strike, it
continues to be on until the current through it falls
below its “holding current.” The holding current is typi-
cally 110mA in the positive direction (current flowing
into the NC/NO pin) and 95mA in the negative direction
at room temperature (see SCR Holding Current vs.
Temperature in the
Typical Operating Characteristics
).
The system should be designed such that any sources
connected to these pins are current limited to a value
below these to make sure the SCR turns off when the
ESD event gets over to resume normal operation. Also,
keep in mind that the holding current varies significant-
ly with temperature. At +85°C, which represents the
worst case, the holding currents drop to 70mA and
65mA in the positive and negative directions respec-
tively. Since these are typical numbers, to get guaran-
teed turn-off of the SCRs under all conditions, the
sources connected to these pins should be current lim-
ited to not more than half these values. When the SCR
is latched, the voltage across it is about ±3V, depend-
ing on the polarity of the pin current. The supply volt-
ages do not affect the holding currents appreciably.
The sources connected to the COM side of the switches
do not need to be current limited since the switches are
made to turn off internally when the corresponding
SCR(s) get latched.
Even though most of the ESD current flows to GND
through the SCRs, a small portion of it goes into the
supplies. Therefore, it is a good idea to bypass the
supply pins with 100nF capacitors directly to the
ground plane.
ESD protection can be tested in various ways. Trans-
mitter outputs and receiver inputs are characterized for
protection to the following:
±15kV using the Human Body Model
±8kV using the Contact Discharge method speci-
fied in IEC 1000-4-2 (formerly IEC 801-2)
±15kV using the Air-Gap Discharge method speci-
fied in IEC 1000-4-2 (formerly IEC 801-2).
ESD Test Conditions
Contact Maxim for a reliability report that documents
test setup, methodology, and results.
Human Body Model
Figure 8 shows the Human Body Model, and Figure 9
shows the current waveform it generates when dis-
charged into a low impedance. This model consists of
a 100pF capacitor charged to the ESD voltage of inter-
est, which is then discharged into the test device
through a 1.5k resistor.
IEC 1000-4-2
The IEC 1000-4-2 standard covers ESD testing and
performance of finished equipment; it does not specifi-
cally refer to integrated circuits. The MAX4551/MAX4552/
MAX4553 enable the design of equipment that meets
Level 4 (the highest level) of IEC 1000-4-2, without
additional ESD protection components.
The major difference between tests done using the
Human Body Model and IEC 1000-4-2 is higher peak
current in IEC 1000-4-2. Because series resistance is
lower in the IEC 1000-4-2 ESD test model (Figure 10),
the ESD withstand voltage measured to this standard
is generally lower than that measured using the
Human Body Model. Figure 11 shows the current
waveform for the ±8kV IEC 1000-4-2 Level 4 ESD
Contact Discharge test.
The Air-Gap test involves approaching the device with
a charged probe. The Contact Discharge method
connects the probe to the device before the probe is
energized.
Beyond-the-Rails is a trademark of Maxim Integrated Products.
Power-Supply Considerations
Overview
The MAX4551/MAX4552/MAX4553 construction is typi-
cal of most CMOS analog switches. They have three
supply pins: V+, V-, and GND. V+ and V- are used to
drive the internal CMOS switches, and they set the lim-
its of the analog voltage on any switch. Reverse ESD-
protection diodes are internally connected between
each analog-signal pin and both V+ and V-. If any ana-
log signal exceeds V+ or V-, one of these diodes con-
ducts. During normal operation these reverse-biased
ESD diodes leak, forming the only current drawn from
V+ or V-.
Virtually all the analog leakage current is through the
ESD diodes. Although the ESD diodes on a given sig-
nal pin are identical and therefore fairly well balanced,
they are reverse biased differently. Each is biased by
either V+ or V- and the analog signal. This means their
leakages vary as the signal varies. The
difference
in the
two diode leakages from the signal path to the V+ and
V- pins constitutes the analog-signal-path leakage cur-
rent. All analog leakage current flows to the supply ter-
minals, not to the other switch terminal. This explains
how both sides of a given switch can show leakage
currents of the same or opposite polarity.
The analog signal paths consist of an N-channel and P-
channel MOSFET with their sources and drains paral-
leled, and their gates driven out of phase to V+ and V-
by the logic-level translators.
V+ and GND power the internal logic and logic-level
translators, and set the input logic thresholds. The
logic-level translators convert the logic levels to
switched V+ and V- signals, to drive the gates of the
analog switches. This drive signal is the only connec-
tion between the logic supplies and the analog sup-
plies. V+ and V- have ESD-protection diodes to GND.
The logic-level inputs and output have ESD protection
to V+ and to GND.
Increasing V- has no effect on the logic-level thresh-
olds, but it does increase the drive to the P-channel
switches, reducing their on-resistance. V- also sets the
negative limit of the analog signal voltage.
The logic-level thresholds are CMOS/TTL compatible
when V+ = +5V. The threshold increases slightly as V+
is raised, and when V+ reaches +12V, the level thresh-
old is about 3.1V. This is above the TTL output high-
level minimum of 2.8V, but still compatible with CMOS
outputs.
Bipolar Supplies
The MAX4551/MAX4552/MAX4553 operate with bipolar
supplies between ±2V and ±6V. The V+ and V- sup-
plies need not be symmetrical, but their sum cannot
exceed the absolute maximum rating of 13.0V. Do not
connect the MAX4551/MAX4552/MAX4553 V+ to +3V,
and then connect the logic-level-input pins to TTL
logic-level signals. TTL logic-level outputs in excess
of the absolute maximum ratings can damage the
part and/or external circuits.
Caution: The absolute maximum V+ to V- differential
voltage is 13.0V. Typical ±6V or 12V supplies with
±10% tolerances can be as high as 13.2V. This voltage
can damage the MAX4551/MAX4552/MAX4553. Even
±5% tolerance supplies may have overshoot or noise
spikes that exceed 13.0V.
Single Supply
The MAX4551/MAX4552/MAX4553 operate from a
single supply between +2V and +12V when V- is con-
nected to GND. All of the bipolar precautions must be
observed.
High-Frequency Performance
In 50 systems, signal response is reasonably flat up
to 50MHz (see
Typical Operating Characteristics
).
Above 20MHz, the on-response has several minor
peaks that are highly layout-dependent. The problem
with high-frequency operation is not turning the switch
on, but turning it off. The off-state switch acts like a
capacitor and passes higher frequencies with less
attenuation. At 10MHz, off-isolation is about -52dB in
50 systems, becoming worse (approximately 20dB
per decade) as frequency increases. Higher circuit
impedances also make off-isolation worse. Adjacent
channel attenuation is about 3dB above that of a bare
IC socket, and is due entirely to capacitive coupling.
MAX4551/MAX4552/MAX4553
±15kV ESD-Protected, Quad,
Low-Voltage, SPST Analog Switches
_______________________________________________________________________________________ 9

MAX4552CSE

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Analog Switch ICs +-15kV ESD-Protected Quad SPST Switch
Lifecycle:
New from this manufacturer.
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