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HSE-B381-045H

P1-P3P4-P5
date 09/07/2017
page
1 of 5
cui.com
SERIES: HSE-BX-045H │ DESCRIPTION: HEAT SINK
FEATURES
• TO-220 package
• placement pins for secure PCB attachment
• round hole for component attachment
• multiple available cut lengths
MODEL
thermal resistance
1
power
dissipation
1
length
(mm)
@ 75°C ΔT,
nat conv
(°C/W)
@ 1 W,
nat conv
(°C/W)
@ 1 W,
200 LFM
(°C/W)
@ 1 W,
400 LFM
(°C/W)
@ 75°C ΔT,
nat conv
(W)
HSE-B254-045H 25.4 11.72 16.12 3.86 2.52 6.40
HSE-B381-045H 38.1 7.58 8.52 2.63 1.82 9.90
HSE-B508-045H 50.8 8.06 10.52 4.38 2.89 9.30
HSE-B635-045H 63.5 6.41 7.99 3.53 2.49 11.70
Note: 1. See performance curves for full thermal resistance details.
2. Custom cut to length options available. Thermal data not available on custom lengths.
PERFORMANCE CURVES
Mounting Surface Temperature
Rise Above Ambient (°C)
0
10
20
30
40
50
60
70
80
90
100
01 2345
Dissipated Power (W)
Without Airflow
200 LFM
400 LFM
6789
10
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Power
(W)
Natural
Conv.
200 LFM 400 LFM
0 0 0 0
1 16.12 3.86 2.52
2 29.41 8.30 5.68
3 40.00 12.22 9.31
4 51.44 16.39 12.14
5 61.45 20.66 15.34
6 72.61 24.92 18.41
7 80.92 28.68 20.86
8 90.03 33.22 23.73
9 96.81 37.23 26.92
10 105.60 41.07 30.04
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
HSE-B254-045H
For more information, please visit the product page.
cui.com
CUI Inc │ SERIES: HSE-BX-045H │ DESCRIPTION: HEAT SINK date 09/07/2017│ page 2 of 5
PERFORMANCE CURVES (CONTINUED)
Mounting Surface Temperature
Rise Above Ambient (°C)
0
10
20
30
40
50
60
70
80
90
100
0 12345
Dissipated Power (W)
Without Airflow
200 LFM
400 LFM
6789
10
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Power
(W)
Natural
Conv.
200 LFM 400 LFM
0 0 0 0
1 8.52 2.63 1.82
2 18.47 5.51 3.87
3 26.83 8.39 5.96
4 33.30 11.14 7.95
5 39.77 13.92 10.01
6 46.62 16.71 12.03
7 53.59 19.45 13.95
8 60.45 22.41 16.05
9 68.22 25.10 17.98
10 75.13 28.11 20.06
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
HSE-B381-045H
Mounting Surface Temperature
Rise Above Ambient (°C)
0
10
20
30
40
50
60
70
80
90
100
0 12345
Dissipated Power (W)
6789
10
Without Airflow
200 LFM
400 LFM
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Power
(W)
Natural
Conv.
200 LFM 400 LFM
0 0 0 0
1 10.52 4.38 2.89
2 19.69 8.39 5.86
3 28.40 12.74 8.86
4 37.10 16.93 12.02
5 44.72 21.55 14.92
6 52.72 25.52 18.01
7 60.03 30.14 20.94
8 66.70 34.56 24.08
9 73.41 38.67 26.72
10 79.99 42.96 29.99
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
HSE-B508-045H
For more information, please visit the product page.
cui.com
CUI Inc │ SERIES: HSE-BX-045H │ DESCRIPTION: HEAT SINK date 09/07/2017│ page 3 of 5
PERFORMANCE CURVES (CONTINUED)
Mounting Surface Temperature
Rise Above Ambient (°C)
0
10
20
30
40
50
60
70
80
90
100
01234 5
Dissipated Power (W)
678910 11 12 13 14
15
Without Airflow
200 LFM
400 LFM
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Power
(W)
Natural
Conv.
200 LFM 400 LFM
0 0 0 0
1 7.99 3.53 2.49
2 17.00 6.57 5.14
3 23.87 9.99 6.67
4 30.80 13.68 9.70
5 37.97 17.18 12.47
6 42.95 21.04 15.09
7 48.42 24.72 17.68
8 54.64 28.07 19.65
9 61.12 31.89 21.97
10 67.12 35.72 24.79
11 72.12 39.54 27.58
12 77.53 43.26 30.28
13 82.73 46.96 32.35
14 88.28 50.47 34.99
15 93.81 54.37 37.14
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
HSE-B635-045H
For more information, please visit the product page.
P1-P3P4-P5

HSE-B381-045H

Mfr. #:
Buy HSE-B381-045H
Manufacturer:
CUI Inc
Description:
Heat Sinks 38.1x45x12.7mm w/pin extrusion TO-220
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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