Spec No. JELF243B-0009Q-01 P.8/10
MURATA MFG.CO., LTD
Reference Only
11.2 Flux, Solder
・Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder.
・Standard thickness of solder paste : 100μm to 150μm.
11.3 Reflow soldering conditions
・Inductance value may be changed a little due to the amount of solder.
So, the chip coil shall be soldered by reflow so that the solder volume can be controlled.
・Pre-heating should be in such a way that the temperature difference between solder and product surface
is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the
temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products
quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the
deterioration of product quality.
・Reflow soldering profile
Standard Profile Limit Profile
Pre-heating 150°C～180°C, 90s±30s
Heating above 220°C, 30s～60s above 230°C, 60s max.
Peak temperature 245°C±3°C 260°C, 10s
Cycle of reflow 2 times 2 times
11.4 Reworking with soldering iron
The following conditions must be strictly followed when using a soldering iron.
Pre-heating 150°C,1 min
Tip temperature 350°C max.
Soldering iron output 80W max.
Tip diameter φ3mm max.
Soldering time 3(+1, -0)s
Time 2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the
crack on the products due to the thermal shock.
11.5 Solder Volume
・ Solder shall be used not to be exceededthe upper limits as shown below.
・ Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
1/3T≦t≦T
T： thickness of product
Upper Limit
Recommendable
t
Limit Profile
Standard Profile
90s±30s
230℃
260℃
245℃±3℃
220℃
30s～60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
