IXFK32N100P

© 2008 IXYS CORPORATION,All rights reserved
Symbol Test Conditions Maximum Ratings
V
DSS
T
J
= 25°C to 150°C 1000 V
V
DGR
T
J
= 25°C to 150°C, R
GS
= 1MΩ 1000 V
V
GSS
Continuous ± 30 V
V
GSM
Transient ± 40 V
I
D25
T
C
= 25°C32A
I
DM
T
C
= 25°C, pulse width limited by T
JM
75 A
I
AR
T
C
= 25°C16A
E
AS
T
C
= 25°C 1.5 J
dV/dt I
S
I
DM
, V
DD
V
DSS
, T
J
150°C 10 V/ns
P
D
T
C
= 25°C 960 W
T
J
-55 ... +150 °C
T
JM
150 °C
T
stg
-55 ... +150 °C
T
L
1.6mm (0.062 in.) from case for 10s 300 °C
T
SOLD
Plastic body for 10s 260 °C
M
d
Mounting torque (IXFK) 1.13/10 Nm/lb.in.
F
C
Mounting force (IXFX) 20..120/4.5..27 Nm/lb.
Weight TO-264 10 g
TO-247 6 g
G = Gate D = Drain
S = Source TAB = Drain
Symbol Test Conditions Characteristic Values
(T
J
= 25°C unless otherwise specified) Min. Typ. Max.
BV
DSS
V
GS
= 0V, I
D
= 3mA 1000 V
V
GS(th)
V
DS
= V
GS
, I
D
= 1mA 3.5 6.5 V
I
GSS
V
GS
= ± 30V, V
DS
= 0V ± 200 nA
I
DSS
V
DS
= V
DSS
50 μA
V
GS
= 0V T
J
= 125°C 2.5 mA
R
DS(on)
V
GS
= 10V, I
D
= 0.5 • I
D25
, Note 1 320 mΩ
N-Channel Enhancement Mode
Avalanche Rated
Fast Intrinsic Diode
Features
z
Fast intrinsic diode
z
International standard packages
z
Unclamped Inductive Switching (UIS)
rated
z
Low package inductance
- easy to drive and to protect
Advantages
z
Easy to mount
z
Space savings
z
High power density
IXFK32N100P
IXFX32N100P
V
DSS
= 1000V
I
D25
= 32A
R
DS(on)
320m
ΩΩ
ΩΩ
Ω
t
rr
300ns
DS99777C(4/08)
PLUS247 (IXFX)
TO-264 (IXFK)
S
G
D
(TAB)
(TAB)
Applications:
z
Switched-mode and resonant mode
power supplies
z
DC-DC Converters
z
Laser Drivers
z
AC and DC motor controls
z
Robotics and servo controls
Polar
TM
Power MOSFET
HiPerFET
TM
IXYS reserves the right to change limits, test conditions, and dimensions.
IXFK32N100P
IXFX32N100P
Symbol Test Conditions Characteristic Values
(T
J
= 25°C unless otherwise specified) Min. Typ. Max.
g
fs
V
DS
= 20V, I
D
= 0.5 • I
D25
, Note 1 13 21 S
C
iss
14.2 nF
C
oss
V
GS
= 0V, V
DS
= 25V, f = 1MHz 815 pF
C
rss
60 pF
R
Gi
Gate input resistance 1.50 Ω
t
d(on)
Resistive Switching Times 50 ns
t
r
V
GS
= 10V, V
DS
= 0.5 • V
DSS
, I
D
= 0.5 • I
D25
55 ns
t
d(off)
R
G
= 1Ω (External) 76 ns
t
f
43 ns
Q
g(on)
225 nC
Q
gs
V
GS
= 10V, V
DS
= 0.5 • V
DSS
, I
D
= 0.5 • I
D25
85 nC
Q
gd
94 nC
R
thJC
0.13 °C/W
R
thCS
0.15 °C/W
Source-Drain Diode
Symbol Test Conditions Characteristic Values
(T
J
= 25°C unless otherwise specified) Min. Typ. Max.
I
S
V
GS
= 0V 32 A
I
SM
Repetitive, pulse width limited by T
JM
128 A
V
SD
I
F
= I
S
, V
GS
= 0V, Note 1 1.5 V
t
rr
300 ns
Q
RM
2.2 μC
I
RM
15 A
Note 1: Pulse test, t 300μs; duty cycle, d 2%.
IXYS MOSFETs and IGBTs are covered 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734 B2 7,157,338B2
by one or more of the following U.S. patents: 4,850,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405 B2 6,759,692 7,063,975 B2
4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6,771,478 B2 7,071,537
TO-264 (IXFK) Outline
Millimeter Inches
Min. Max. Min. Max.
A 4.82 5.13 .190 .202
A1 2.54 2.89 .100 .114
A2 2.00 2.10 .079 .083
b 1.12 1.42 .044 .056
b1 2.39 2.69 .094 .106
b2 2.90 3.09 .114 .122
c 0.53 0.83 .021 .033
D 25.91 26.16 1.020 1.030
E 19.81 19.96 .780 .786
e 5.46 BSC .215 BSC
J 0.00 0.25 .000 .010
K 0.00 0.25 .000 .010
L 20.32 20.83 .800 .820
L1 2.29 2.59 .090 .102
P 3.17 3.66 .125 .144
Q 6.07 6.27 .239 .247
Q1 8.38 8.69 .330 .342
R 3.81 4.32 .150 .170
R1 1.78 2.29 .070 .090
S 6.04 6.30 .238 .248
T 1.57 1.83 .062 .072
Dim.
Terminals: 1 - Gate
2 - Drain (Collector)
3 - Source (Emitter)
4 - Drain (Collector)
PLUS 247
TM
(IXFX) Outline
Dim. Millimeter Inches
Min. Max. Min. Max.
A 4.83 5.21 .190 .205
A
1
2.29 2.54 .090 .100
A
2
1.91 2.16 .075 .085
b 1.14 1.40 .045 .055
b
1
1.91 2.13 .075 .084
b
2
2.92 3.12 .115 .123
C 0.61 0.80 .024 .031
D 20.80 21.34 .819 .840
E 15.75 16.13 .620 .635
e 5.45 BSC .215 BSC
L 19.81 20.32 .780 .800
L1 3.81 4.32 .150 .170
Q 5.59 6.20 .220 0.244
R 4.32 4.83 .170 .190
I
F
= 16A, -di/dt = 100A/μs
V
R
= 100V, V
GS
= 0V
PRELIMINARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from data gathered during objective characterizations of preliminary engineering lots; but also may yet
contain some information supplied during a pre-production design evaluation. IXYS reserves the right
to change limits, test conditions, and dimensions without notice.
© 2008 IXYS CORPORATION,All rights reserved
IXFK32N100P
IXFX32N100P
Fig. 4. R
DS(on)
Normalized to I
D
= 16A Value
vs. Junction Temperature
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
-50 -25 0 25 50 75 100 125 150
T
J
- Degrees Centigrade
R
DS(on)
- Normalized
V
GS
= 10V
I
D
= 32A
I
D
= 16A
Fig. 5. R
DS(on)
Normalized to I
D
= 16A Value
vs. Drain Current
0.8
1
1.2
1.4
1.6
1.8
2
2.2
2.4
2.6
0 5 10 15 20 25 30 35 40 45 50 55 60 65
I
D
- Amperes
R
DS(on)
- Normalized
V
GS
= 10V
15V
- - - -
T
J
= 125ºC
T
J
= 25ºC
Fig. 6. Maximum Drain Current vs.
Case Temperature
0
5
10
15
20
25
30
35
-50 -25 0 25 50 75 100 125 150
T
C
- Degrees Centigrade
I
D
- Amperes
Fig. 1. Output Characteristics
@ 25ºC
0
4
8
12
16
20
24
28
32
012345678910
V
DS
- Volts
I
D
- Amperes
V
GS
= 15V
10V
9V
7V
8V
Fig. 2. Extended Output Characteristics
@ 25ºC
0
10
20
30
40
50
60
70
0 5 10 15 20 25 30
V
DS
- Volts
I
D
- Amperes
V
GS
= 15V
10V
9V
7V
8V
Fig. 3. Output Characteristics
@ 125ºC
0
4
8
12
16
20
24
28
32
0 2 4 6 8 10 12 14 16 18 20 22
V
DS
- Volts
I
D
- Amperes
V
GS
= 15V
10V
9V
7V
8V
6V

IXFK32N100P

Mfr. #:
Manufacturer:
Littelfuse
Description:
MOSFET 32 Amps 1000V 0.32 Rds
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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