ADG1404 Data Sheet
Rev. B | Page 16 of 16
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-153-AB-1
061908-A
8°
0°
4.50
4.40
4.30
14
8
7
1
6.40
BSC
PIN 1
5.10
5.00
4.90
0.65 BSC
0.15
0.05
0.30
0.19
1.20
MAX
1.05
1.00
0.80
0.20
0.09
0.75
0.60
0.45
COPLANARITY
0.10
SEATING
PLANE
Figure 33. 14-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-14)
Dimension shown in millimeters
COMPLIANT
TO
JEDEC STANDARDS MO-220-WGGC.
042709-A
1
0.65
BSC
BOTTOM VIEWTOP VIEW
16
5
8
9
12
13
4
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
4.10
4.00 SQ
3.90
0.50
0.40
0.30
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
PIN 1
INDICATOR
0.35
0.30
0.25
2.60
2.50 SQ
2.40
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 34. 16-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.75 mm Package Height
(CP-16-26)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADG1404YRUZ −40°C to +125°C 14-Lead Thin Shrink Small Outline Package [TSSOP] RU-14
ADG1404YRUZ-REEL7 −40°C to +125°C 14-Lead Thin Shrink Small Outline Package [TSSOP] RU-14
ADG1404YCPZ-REEL −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16-26
ADG1404YCPZ-REEL7 −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16-26
1
Z = RoHS Compliant Part.
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D06841-0-9/16(B)
