ADF4360-5 Data Sheet
Rev. C | Page 22 of 24
PCB DESIGN GUIDELINES FOR CHIP SCALE PACKAGE
The leads on the chip scale package (CP-24) are rectangular. The
printed circuit board pad for these should be 0.1 mm longer
than the package lead length and 0.05 mm wider than the package
lead width. The lead should be centered on the pad to ensure
that the solder joint size is maximized.
The bottom of the chip scale package has a central thermal pad.
The thermal pad on the printed circuit board should be at least
as large as this exposed pad. On the printed circuit board, there
should be a clearance of at least 0.25 mm between the thermal
pad and the inner edges of the pad pattern to ensure that shorting
is avoided.
Thermal vias may be used on the printed circuit board thermal
pad to improve thermal performance of the package. If vias are
used, they should be incorporated into the thermal pad at a
1.2 mm pitch grid. The via diameter should be between 0.3 mm
and 0.33 mm, and the via barrel should be plated with 1 ounce
of copper to plug the via.
The user should connect the printed circuit thermal pad to
AGND. This is internally connected to AGND.
OUTPUT MATCHING
There are a number of ways to match the output of the ADF4360-5
for optimum operation; the most basic is to use a 50 Ω resistor
to V
VCO
. A dc bypass capacitor of 100 pF is connected in series
as shown Figure 21. Because the resistor is not frequency de-
pendent, this provides a good broadband match. The output
power in this circuit typically gives −4.5 dBm output power
into a 50 Ω load.
100pF
04439-025
RF
OUT
V
VCO
50
Ω
51Ω
Figure 21. Simple ADF4360-5 Output Stage
A better solution is to use a shunt inductor (acting as an RF
choke) to V
VCO
. This gives a better match and, therefore, more
output power. Additionally, a series inductor is added after the
dc bypass capacitor to provide a resonant LC circuit. This tunes
the oscillator output and provides approximately 10 dB addi-
tional rejection of the second harmonic. The shunt inductor
needs to be a relatively high value (>40 nH).
Experiments have shown that the circuit shown in Figure 22
provides an excellent match to 50 Ω over the operating range of
the ADF4360-5. This gives approximately −3 dBm output power
across the frequency range of the ADF4360-5. Both single-ended
architectures can be examined using the EV-ADF4360-5EB1Z
evaluation board.
5.1nH
47nH
3.9pF
04439-026
RF
OUT
V
VCO
50
Ω
Figure 22. Optimum ADF4360-5 Output Stage
If the user does not need the differential outputs available on
the ADF4360-5, the user may either terminate the unused output
or combine both outputs using a balun. The circuit in Figure 23
shows how best to combine the outputs.
5.1nH
6.8nH
47nH
6.8nH
2.2pF
10pF
2.2pF
50Ω
5.1nH
RF
OUT
A
V
VCO
RF
OUT
B
04439-027
Figure 23. Balun for Combining ADF4360-5 RF Outputs
The circuit in Figure 23 is a lumped-lattice-type LC balun. It is
designed for a center frequency of 1.3 GHz and outputs 5.0 dBm
at this frequency. The series 5.1 nH inductor is used to tune out
any parasitic capacitance due to the board layout from each input,
and the remainder of the circuit is used to shift the output of one
RF input by +90° and the second by −90°, thus combining the
two. The action of the 6.8 nH inductor and the 2.2 pF capacitor
accomplishes this. The 47 nH is used to provide an RF choke
to feed the supply voltage, and the 10 pF capacitor provides the
necessary dc block. To ensure good RF performance, the circuits
in Figure 22 and Figure 23 are implemented with Coilcraft
0402/0603 inductors and AVX 0402 thin-film capacitors.
Alternatively, instead of the LC balun shown in Figure 23, both
outputs may be combined using a 180° rat-race coupler.
