NLV14174BDR2G

MC14174B
http://onsemi.com
4
SWITCHING CHARACTERISTICS (Note 5) (C
L
= 50 pF, T
A
= 25_C)
Characteristic Symbol
V
DD
Vdc
All Types
Unit
Min
Typ
(Note 6)
Max
Output Rise and Fall Time
t
TLH
, t
THL
= (1.35 ns/pF) C
L
+ 32 ns
t
TLH
, t
THL
= (0.6 ns/pF) C
L
+ 20 ns
t
TLH
, t
THL
= (0.4 ns/pF) C
L
+ 20 ns
t
TLH
, t
THL
5.0
10
15
100
50
40
200
100
80
ns
Propagation Delay Time — Clock to Q
t
PLH
, t
PHL
= (0.9 ns/pF) C
L
+ 165 ns
t
PLH
, t
PHL
= (0.36 ns/pF) C
L
+ 64 ns
t
PLH
, t
PHL
= (0.26 ns/pF) C
L
+ 52 ns
t
PLH
, t
PHL
5.0
10
15
210
85
65
400
160
120
ns
Propagation Delay Time — Reset to Q
t
PHL
= (0.9 ns/pF) C
L
+ 205 ns
t
PHL
= (0.36 ns/pF) C
L
+ 79 ns
t
PHL
= (0.26 ns/pF) C
L
+ 62 ns
t
PHL
5.0
10
15
250
100
75
500
200
150
ns
Clock Pulse Width t
WH
5.0
10
15
150
90
70
75
45
35
ns
Reset Pulse Width t
WL
5.0
10
15
200
100
80
100
50
40
ns
Clock Pulse Frequency f
cl
5.0
10
15
7.0
12
15.5
2.0
5.0
6.5
mHz
Clock Pulse Rise and Fall Time t
TLH
, t
THL
5.0
10
15
15
5.0
4.0
ms
Data Setup Time t
su
5.0
10
15
40
20
15
20
10
0
ns
Data Hold Time t
h
5.0
10
15
80
40
30
40
20
15
ns
Reset Removal Time t
rem
5.0
10
15
250
100
80
125
50
40
ns
5. The formulas given are for the typical characteristics only at 25_C.
6. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
MC14174B
http://onsemi.com
5
PACKAGE DIMENSIONS
SOIC16
CASE 751B05
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
18
16 9
SEATING
PLANE
F
J
M
R
X 45
_
G
8 PLP
B
A
M
0.25 (0.010) B
S
T
D
K
C
16 PL
S
B
M
0.25 (0.010) A
S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 9.80 10.00 0.386 0.393
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019
____
6.40
16X
0.58
16X
1.12
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT
16
89
8X
MC14174B
http://onsemi.com
6
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
A
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
18
916
K
PLANE
T
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0 10 0 10
S 0.020 0.040 0.51 1.01
____
PDIP16
CASE 64808
ISSUE T
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copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. SCILLC
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limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
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MC14174B/D
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NLV14174BDR2G

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