NSR0170P2T5G

© Semiconductor Components Industries, LLC, 2008
April, 2008 - Rev. 0
1 Publication Order Number:
NSR0170P2/D
NSR0170P2T5G
Schottky Barrier Diode
Schottky barrier diodes are optimized for very low forward voltage
drop and low leakage current and are used in a wide range of dc-dc
converter, clamping and protection applications in portable devices.
NSR0170P2 in a SOD-923 miniature package enables designers to
meet the challenging task of achieving higher efficiency and meeting
reduced space requirements.
Features
Very Low Forward Voltage Drop - 560 mV @ 10 mA
Low Reverse Current - 25 nA @ 50 V VR
70 mA of Continuous Forward Current
Power Dissipation of 240 mW with Minimum Trace
Very High Switching Speed
Low Capacitance - CT = 2 pF
This is a Pb-Free Device
Typical Applications
LCD and Keypad Backlighting
Camera Photo Flash
Buck and Boost dc-dc Converters
Reverse Voltage and Current Protection
Clamping & Protection
Markets
Mobile Handsets
MP3 Players
Digital Camera and Camcorders
Notebook PCs & PDAs
GPS
MAXIMUM RATINGS
Rating Symbol Value Unit
Reverse Voltage V
R
70 V
Forward Current (DC) I
F
70 mA
ESD Rating: Human Body Model
Machine Model
ESD Class 2
Class B
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
70 V SCHOTTKY
BARRIER DIODE
1
CATHODE
2
ANODE
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Device Package Shipping
ORDERING INFORMATION
NSR0170P2T5G SOD-923
(Pb-Free)
2 mm Pitch
8000/Tape & Reel
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
SOD-923
CASE 514AB
PLASTIC
Q = Specific Device Code
M = Month Code
G = Pb-Free Package
(Note: Microdot may be in either location)
MARKING
DIAGRAM
MG
G
1
2
12
Q
NSR0170P2T5G
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2
THERMAL CHARACTERISTICS
Characteristic Symbol Min Typ Max Unit
Thermal Resistance
Junction-to-Ambient (Note 1)
Total Power Dissipation @ T
A
= 25°C
R
q
JA
P
D
520
240
°C/W
mW
Thermal Resistance
Junction-to-Ambient (Note 2)
Total Power Dissipation @ T
A
= 25°C
R
q
JA
P
D
175
710
°C/W
mW
Junction and Storage Temperature Range T
J
, T
stg
-55 to +150 °C
1. Mounted onto a 4 in square FR-4 board 10 mm sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state.
2. Mounted onto a 4 in square FR-4 board 1 in sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state.
ELECTRICAL CHARACTERISTICS (T
A
= 25°C unless otherwise noted)
Characteristic
Symbol Min Typ Max Unit
Reverse Leakage
(V
R
= 50 V)
(V
R
= 70 V)
I
R
25
-
90
3.0
nA
mA
Forward Voltage
(I
F
= 1.0 mA)
(I
F
= 10 mA)
(I
F
= 15 mA)
V
F
0.34
0.56
0.65
0.39
0.64
0.73
V
Total Capacitance
(V
R
= 0 V, f = 1 MHz)
CT
2.0 pF
Figure 1. Forward Voltage Figure 2. Leakage Current
V
F
, FORWARD VOLTAGE (V) V
R
, REVERSE VOLTAGE (V)
1.61.00.80.60.20
0.001
0.01
0.1
1
10
100
1000
706050403020100
0.00001
0.0001
0.001
0.01
0.1
10
100
Figure 3. Total Capacitance
V
R
, REVERSE VOLTAGE (V)
8060403020100
0
0.5
1.0
1.5
2.0
2.5
I
F
, FORWARD CURRENT (mA)
I
r
, REVERSE CURRENT (mA)
C
T
, TOTAL CAPACITANCE (pF)
0.4
150°C
125°C
-40°C
85°C
25°C
150°C
125°C
-40°C
85°C
25°C
1
50 70
T
A
= 25°C
1.2 1.4
NSR0170P2T5G
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3
PACKAGE DIMENSIONS
SOD-923
CASE 514AB-01
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
DIM MIN NOM MAX
MILLIMETERS
A 0.34 0.37 0.40
b 0.15 0.20 0.25
c 0.07 0.12 0.17
D 0.75 0.80 0.85
E 0.55 0.60 0.65
0.95 1.00 1.05
L 0.05 0.10 0.15
H
E
0.013 0.015 0.016
0.006 0.008 0.010
0.003 0.005 0.007
0.030 0.031 0.033
0.022 0.024 0.026
0.037 0.039 0.041
0.002 0.004 0.006
MIN NOM MAX
INCHES
D
E
b
c
A
L
2X
-Y-
-X-
0.08 (0.0032)
XY
H
E
0.40
0.30
0.90
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
21
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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NSR0170P2/D
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Sales Representative

NSR0170P2T5G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Schottky Diodes & Rectifiers 70V SCHOTTKY DIODE SOD923
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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