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TS19730CX6 RFG

P1-P3P4-P6P7-P7
TS19730CX6
Taiwan Semiconductor
1 Version: B1601
Single-Stage Low THD Buck-Boost PWM Control LED Driver
DESCRIPTION
The TS19730 is a high power factor, low THD and high
accuracy constant current PWM controller. TS19730
achieves high power factor and high efficiency by
discontinuous conduction mode (DCM). The line and
load regulation of LED current are within ±2.5%.
TS19730 also provides gate driving voltage clamping,
V
CC
over-voltage protection, and system output
open/short circuit protection to increase IC performance.
FEATURES
● Low THD <10%
● Constant Current Accuracy within ±2.5%
● High Power Factor >0.9
● Low BOM Cost
● Discontinuous Conduction Mode Control
● Gate Output Voltage Clamp
● LED Open Protection
● LED Short protection
● Over Current Protection (OCP)
● Over Thermal Protection (OTP)
● Compliant to RoHS Directive 2011/65/EU and in
accordance to WEEE 2002/96/EC.
● Halogen-free according to IEC 61249-2-21
APPLICATION
● LED lighting
● Down lights, Tube lamps, PAR Lamps, Bulbs
SOT
-
26
Pin
Definition
:
1. V
CC
2. GND
3. OUT
4. CL
5. COM
6. CS
Note: MSL 3 (Moisture Sensitivity Level) per J-STD-020
M
AXIMUM RATINGS
(Note 1)
PARAMETER SYMBOL LIMIT UNIT
Power Supply Pin V
CC
40 V
CL Voltage to GND V
CL
-0.3 to 5.5 V
OUT Voltage to GND V
OUT
-0.3 to 40 V
CS Voltage to GND V
CS
-0.3 to 5.5 V
COM Voltage to GND V
COM
-0.3 to 5.5 V
Junction Temperature Range T
J
-40 to +150 °C
Storage Temperature Range T
STG
-65 to +150 °C
Lead Temperature (Soldering 10s) T
LEAD
260 °C
Power Dissipation @ T
A
=25 °C P
D
0.3 W
ESD Rating (Human Body Mode)
(Note2)
HBM 2 kV
ESD Rating (Machine Mode)
(Note 2)
MM 200 V
TS19730CX6
Taiwan Semiconductor
2 Version: B1601
THERMAL PERFORMANCE
PARAMETER SYMBOL LIMIT UNIT
Thermal Resistance - Junction to Case
R
ӨJC
106.6 °C/W
Thermal Resistance - Junction to Ambient
R
ӨJA
220 °C/W
Note: R
ӨJA
is the sum of the junction-to-case and case-to-ambient thermal resistances. The case thermal reference is defined at
the solder mounting surface of the drain pins. R
ӨJA
is guaranteed by design while R
ӨCA
is determined by the user’s board
design. R
ӨJA
shown below for single device operation on FR-4 PCB in still air. Thermal Resistance is specified with the
component mounted on a low effective thermal conductivity test board in free air at T
A
=25°C.
RECOMMENDED OPERATING CONDITIONS
(Note 3)
PARAMETER SYMBOL CONDITIONS UNIT
Power Supply Pin V
CC
33 V
CL Voltage to GND V
CL
-0.3 to 5 V
OUT Voltage to GND V
OUT
-0.3 to 19 V
CS Voltage to GND V
CS
-0.3 to 5 V
COM Voltage to GND V
COM
-0.3 to 5 V
Operating Junction Temperature Range T
J
-40 to +125 °C
Operating Ambient Temperature Range T
OPA
-40 to +85
°C
ELECTRICAL SPECIFICATIONS
(V
CC
= 18V, T
A
= 25°C unless otherwise noted)
PARAMETER SYMBOL
CONDITIONS MIN
TYP
MAX
UNIT
Supply Voltage
Start-up Current V
CC(ST)
V
CC
= V
UVLO(on)
-1V -- 45 -- μA
Operating Current I
OPA
With 1nF load on out pin -- 2.1 2.6 mA
UVLO(off) V
UVLO(off)
7 8 9 V
UVLO(on) V
UVLO(on)
16 17.5 19 V
OVP Level on V
CC
Pin V
OVP
29 31 33 V
Voltage Feedback
Feedback Reference Voltage V
FB
0.196
0.2 0.204
V
Trans
conductance
g
m
-- 58 -- μS
Output Sink Current I
O-SINK
-- 5.8 -- μA
Output Source Current I
O-SOURCE
-- 5.8 -- μA
Current Sensing
Open Loop Voltage V
OLP
CS Pin Open -- 5 -- V
Leading-Edge Blanking Time t
LEB
-- 400 -- ns
Delay to Output t
DELAY
-- 100 -- ns
Current Limit
CL Limit Voltage V
OCP
-- 0.3 -- V
Switching Frequency
Start Frequency
f
STR
-- 4.5 -- kHz
TS19730CX6
Taiwan Semiconductor
3 Version: B1601
ELECTRICAL SPECIFICATIONS
(V
CC
= 18V, T
A
= 25°C unless otherwise noted)
PARAMETER SYMBOL
CONDITIONS MIN
TYP
MAX
UNIT
Gate Driver Output
Rising Time
t
RISE
Load Capacitance =1nF -- 90 -- ns
Falling Time
t
FALL
Load Capacitance =1nF -- 40 -- ns
VGATE-Clamp
V
GATE
-- 12.5 15 V
Thermal Section
(Note 5,6)
Thermal Shutdown
-- 150 -- °C
Thermal Shutdown Release
-- 120 -- °C
Note:
1. Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational
sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may
remain possibility to affect device reliability.
2. Devices are ESD sensitive. Handing precaution recommended.
3. Thermal Resistance is specified with the component mounted on a low effective thermal conductivity test board in free air at
T
A
=25°C.
4. The device is not guaranteed to function outside its operating conditions.
5. Guaranteed by design.
6. Auto Recovery Type.
ORDERING INFORMATION
PART NO.
PACKAGE
PACKING
TS19730CX6 RFG SOT-26 3,000pcs / 7” Reel
P1-P3P4-P6P7-P7

TS19730CX6 RFG

Mfr. #:
Buy TS19730CX6 RFG
Manufacturer:
Taiwan Semiconductor
Description:
LED Lighting Drivers single-stage low THD buck-boost PWM control LED driver
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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