13
Figure 3. Cascaded ICs
CE
IC2
BITS 160 – 319
CHARACTERS 4 – 7
RS
BL
SEL
OSC
CLK
D
OUT
D
IC1
BITS 0 – 159
CHARACTERS 0 – 3
D
IN
RS
BL
SEL
OSC
CLK
D
OUT
CE
RESET
RESET
RS
BL
SEL
OSC
CLK
D
CE
RESET
D
IN
OUT
IN
14
Equation 1:
T
J
MAX = T
A
+ P
D
* Rq
JA
Where:
T
J
MAX = maximum IC junction temperature
T
A
= ambient temperature surrounding the display
Rq
JA
= thermal resistance from the IC junction to ambient
P
D
= power dissipated by the IC
Equation 2:
P
D
= (N * I
PIXEL
* Duty Factor * V
LED
) + I
LOGIC
* V
LOGIC
Where:
P
D
= total power dissipation
N = number of pixels on (maximum 4 char * 5 * 7 = 140)
I
PIXEL
= peak pixel current.
Duty Factor = 1/8 * Osc cyc/64
Osc cyc = number of ON oscillator cycles per row
I
LOGIC
= IC logic current
V
LOGIC
= logic supply voltage
Equation 3:
I
PEAK
= M * 20 * I
PIXEL
Where:
I
PEAK
= maximum instantaneous peak current for the display
M = number of ICs in the system
20 = maximum number of LEDs on per IC
I
PIXEL
= peak current for one LED
Equation 4:
I
LED
(AVG) = N * I
PIXEL
* 1/8 * (oscillator cycles)/64
(see Variable Denitions above)
Figure 4.
P
D
MAX – MAXIMUM POWER
DISSIPATION PER IC – W
0
25
T
A
– AMBIENT TEMPERATURE – °C
0.7
0.6
0.5
0.4
0.3
0.2
0.1
60555045403530
0.8
0.9
1.0
1.1
1.2
8580757065
90
1.3
R = 100 °C/W
J-A
θ
Appendix B. Electrical Considerations
Appendix A. Thermal Considerations
The display IC has a maximum junction temperature of
150°C. The IC junction temperature can be calculated
with Equation 1.
A typical value for Rq
J-A
is 100 °C/W. This value is typical
for a display mounted in a socket and covered with a
plastic lter. The socket is soldered to a .062 in. thick PCB
with .020 inch wide, one ounce copper traces.
P
D
can be calculated as in Equa tion 2.
Figure 4 shows how to derate the power of one IC versus
ambient temperature. Opera tion at high ambient tem-
peratures may require the power per IC to be reduced.
The power con sump tion can be reduced by changing
either the N, I
PIXEL
, Osc cyc or V
LED
. Changing V
LOGIC
has
very little impact on the power consumption.
15
Appendix B. Electrical Considerations (Continued...)
Current Calculations
The peak and average display current requirements have a signicant impact on power supply selection. The
maximum peak current is calculated with Equation 3.
The average current required by the display can be calculated with Equation 4.
The power supply has to be able to supply I
PEAK
transients and supply I
LED
(AVG) continuously. The range on V
LED
allows noise on this supply without sig ni cantly changing the display brightness.
V
LOGIC
and V
LED
Considerations
The display uses two indepen dent electrical systems. One system is used to power the display’s logic and the
other to power the displays LEDs. These two systems keep the logic supply clean.
Separate electrical systems allow the voltage applied to V
LED
and V
LOGIC
to be varied independently. Thus, V
LED
can
vary from 0 to 5.5 V without aecting either the Dot or the Control Registers. V
LED
can be varied between 4.0 to
5.5 V with out any noticeable variation in light output. However, oper at ing V
LED
below 4.0 V may cause objection-
able mismatch between the pixels and is not recommended. Dimming the display by pulse width modulat ing
V
LED
is also not recommended.
V
LOGIC
can vary from 3.0 V to 5.5 V without aecting either the displayed message or the display intensity. How-
ever, operation below 4.5 V will change the timing and logic levels and operation below 3 V may cause the Dot
and Control Registers to be altered.
The logic ground is internally connected to the LED ground by a substrate diode. This diode becomes forward
biased and conducts when the logic ground is 0.4 V greater than the LED ground. The LED ground and the logic
ground should be connected to a common ground which can withstand the current introduced by the switching
LED drivers. When separate ground connections are used, the LED ground can vary from -0.3 V to +0.3 V with
respect to the logic ground. Voltages below -0.3 V can cause all the dots to be ON. Voltage above +0.3 V can
cause dimming and dot mismatch. The LED ground for the LED drivers can be routed separately from the logic
ground until an appropri ate ground plane is available. On long interconnections between the display and the
host system, voltage drops on the analog ground can be kept from aecting the display logic levels by isolating
the two grounds.
Electrostatic Discharge
The inputs to the ICs are pro tected against static discharge and input current latchup. How ever, for best results,
standard CMOS handling precautions should be used. Before use, the HCMS-29xx should be stored in antistatic
tubes or in conductive material. During assembly, a grounded conductive work area should be used and assem-
bly personnel should wear conduc tive wrist straps. Lab coats made of synthetic material should be avoided since
they are prone to static buildup. Input current latchup is caused when the CMOS inputs are subjected to either a
voltage below ground (V
IN
< ground) or to a voltage higher than V
LOGIC
(V
IN
> V
LOGIC
) and when a high current is
forced into the input. To prevent input current latchup and ESD damage, unused inputs should be con nected to
either ground or V
LOGIC
. Voltages should not be applied to the inputs until V
LOGIC
has been applied to the display.
Appendix C. Oscillator
The oscillator provides the internal refresh circuitry with a signal that is used to synchron ize the columns and
rows. This ensures that the right data is in the dot drivers for that row. This signal can be supplied from either an
external source or the internal source.
A display refresh rate of 100 Hz or faster ensures icker-free operation. Thus for an external oscillator the frequency
should be greater than or equal to 512 x 100 Hz = 51.2 kHz. Operation above 1 MHz without the prescaler or 8
MHz with the prescaler may cause noticeable pixel to pixel mismatch.

HCMS-2912

Mfr. #:
Manufacturer:
Broadcom / Avago
Description:
LED Displays & Accessories Red 626nm 1x8 Alphanumeric
Lifecycle:
New from this manufacturer.
Delivery:
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