DMOS Microstepping Driver with Translator
A3983
12
Allegro MicroSystems, LLC
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
LP Package, 24-Pin TSSOP with Exposed Thermal Pad
1.20 MAX
C
SEATING
PLANE
0.15 MAX
C0.10
24X
0.65
6.103.00
4.32
1.65
0.45
0.65
0.25
21
24
3.00
4.32
(1.00)
GAUGE PLANE
SEATING PLANE
B
A
A
Terminal #1 mark area
B
For reference only
(reference JEDEC MO-153 ADT)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
Reference land pattern layout (reference IPC7351
TSOP65P640X120-25M); all pads a minimum of 0.20 mm from all
adjacent pads; adjust as necessary to meet application process
requirements and PCB layout tolerances; when mounting on a multilayer
PCB, thermal vias at the exposed thermal pad land can improve thermal
dissipation (reference EIA/JEDEC Standard JESD51-5)
PCB Layout Reference View
Exposed thermal pad (bottom surface)
C
C
7.80 ±0.10
4.40 ±0.10 6.40 ±0.20
0.60 ±0.15
4° ±4
0.25
+0.05
–0.06
0.15
+0.05
–0.06