SI3981DV-T1-E3

Vishay Siliconix
Si3981DV
Document Number: 72502
S13-0631-Rev. E, 25-Mar-13
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: pmostechsupport@vishay.com
Dual P-Channel 20 V (D-S) MOSFET
FEATURES
TrenchFET
®
Power MOSFET
Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
Battery Switch for Portable Devices
Computers
- Bus Switch
- Load Switch
Note:
a. Surface mounted on 1" x 1" FR4 board.
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
()I
D
(A)
- 20
0.185 at V
GS
= - 4.5 V
- 1.9
0.260 at V
GS
= - 2.5 V
- 1.6
0.385 at V
GS
= - 1.8 V
- 0.7
TSOP-6
Top V iew
6
4
1
2
3
5
2.85 mm
3 mm
D
2
G
2
S
1
S
2
D
1
G
1
Ordering Information:
Si3981DV-T1-GE3 (Lead (Pb)-free and Halogen-free)
Marking Code: MCxxx
S
2
G
2
D
2
P-Channel MOSFET
S
1
G
1
D
1
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T
A
= 25 °C, unless otherwise noted)
Parameter Symbol 5 s Steady State Unit
Drain-Source Voltage
V
DS
- 20
V
Gate-Source Voltage
V
GS
± 8
Continuous Drain Current (T
J
= 150 °C)
a
T
A
= 25 °C
I
D
- 1.9 - 1.6
A
T
A
= 70 °C
- 1.5 - 1.3
Pulsed Drain Current
I
DM
- 8
Continuous Source Current (Diode Conduction)
a
I
S
- 1 - 0.72
Maximum Power Dissipation
a
T
A
= 25 °C
P
D
1.08 0.80
W
T
A
= 70 °C
0.69 0.51
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150 °C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
a
t 5 s
R
thJA
97 115
°C/W
Steady State 132 155
Maximum Junction-to-Foot (Drain) Steady State
R
thJF
78 95
Vishay Siliconix
Si3981DV
www.vishay.com
2
Document Number: 72502
S13-0631-Rev. E, 25-Mar-13
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: pmostechsupport@vishay.com
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
SPECIFICATIONS (T
J
= 25 °C, unless otherwise noted)
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Gate Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= - 250 µA
- 0.40 - 1.1 V
Gate-Body Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 8 V
± 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= - 20 V, V
GS
= 0 V
- 1
µA
V
DS
= - 20 V, V
GS
= 0 V, T
J
= 85 °C
- 10
On-State Drain Current
a
I
D(on)
V
DS
=- 5 V, V
GS
= - 4.5 V
- 5 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= - 4.5 V, I
D
= - 1.9 A
0.146 0.185
V
GS
= - 2.5 V, I
D
= - 1.6 A
0.210 0.260
V
GS
= - 1.8 V, I
D
= - 0.7 A
0.306 0.385
Forward Transconductance
a
g
fs
V
DS
= - 5 V, I
D
= - 1.9 A
4S
Diode Forward Voltage
a
V
SD
I
S
= - 1 A, V
GS
= 0 V
- 0.84 - 1.1 V
Dynamic
b
Total Gate Charge
Q
g
V
DS
= - 10 V, V
GS
= - 4.5 V, I
D
= - 1.9 A
3.2 5
nCGate-Source Charge
Q
gs
0.42
Gate-Drain Charge
Q
gd
0.84
Gate Resistance
R
g
f = 1 MHz 6
Tur n - O n D e l ay Time
t
d(on)
V
DD
= - 10 V, R
L
= 10
I
D
- 1 A, V
GEN
= - 4.5 V, R
g
= 6
30 45
ns
Rise Time
t
r
50 85
Turn-Off Delay Time
t
d(off)
45 85
Fall Time
t
f
21 50
Source-Drain Reverse Recovery Time
t
rr
I
F
= - 1 A, dI/dt = 100 A/µs
20 40
Output Characteristics
0
1
2
3
4
5
6
7
8
012345
V
DS
- Drain-to-Source Voltage (V)
I
D
- Drain Current (A)
V
GS
= 5 V thru 3 V
2 V
1.5 V
2.5 V
Transfer Characteristics
0
1
2
3
4
5
6
7
8
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
V
GS
- Gate-to-Source Voltage (V)
I
D
- Drain Current (A)
T
C
= - 55 °C
125 °C
25 °C
Vishay Siliconix
Si3981DV
Document Number: 72502
S13-0631-Rev. E, 25-Mar-13
www.vishay.com
3
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: pmostechsupport@vishay.com
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
On-Resistance vs. Drain Current
Gate Charge
Source-Drain Diode Forward Voltage
0.0
0.1
0.2
0.3
0.4
0.5
0.6
01234567
R
DS(on)
I
D
- Drain Current (A)
V
GS
= 4.5 V
V
GS
= 1.8 V
V
GS
= 2.5 V
- On-Resistance ()
0
1
2
3
4
5
6
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
GS
V
DS
= 10 V
I
D
= 1.9 A
1.2 1.5
0.1
1
10
0 0.3 0.6 0.9
T
J
= 25 °C
T
J
= 150 °C
V
SD
- Source-to-Drain Voltage (V)
I
S
- Source Current (A)
Capacitance
On-Resistance vs. Junction Temperature
On-Resistance vs. Gate-to-Source Voltage
0
50
100
150
200
250
300
350
400
048121620
V
DS
- Drain-to-Source Voltage (V)
C - Capacitance (pF)
C
oss
C
iss
C
rss
0.6
0.8
1.0
1.2
1.4
1.6
- 50 - 25 0 25 50 75 100 125 150
I
D
= 1.9 A
T
J
- Junction Temperature (°C)
R
DS(on)
- On-Resistance
(Normalized)
V
GS
= 4.5 V
0.0
0.1
0.2
0.3
0.4
0.5
0123456
V
GS
- Gate-to-Source Voltage (V)
I
D
= 1.9 A
- On-Resistance ()R
DS(on)

SI3981DV-T1-E3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET RECOMMENDED ALT 78-SI3993CDV-T1-GE3
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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