TSL2560, TSL2561
LIGHT-TO-DIGITAL CONVERTER
TAOS059N − MARCH 2009
35
The LUMENOLOGY r Company
r
r
Copyright E 2009, TAOS Inc.
www.taosinc.com
MECHANICAL DATA
PACKAGE CL-6 Six-Lead Surface Mount Device
6 0.65
0.30
2.60
0.25 0.25
6 R 0.18
0.18
0.35
1.05
2.20
4 0.35
OP VIEW
BOTTOM VIEW
IDE VIEW
Lead Free
Pb
Photo-Active Area
0.70
0.35
Pin 1 Marker
TOP VIEW
1
5
6
2
4
3
0.55
0.55
2
NOTES: A. All linear dimensions are in millimeters. Dimension tolerance is ± 0.20 mm unless otherwise noted.
B. The photo-active area is 1398 μm by 203 μm.
C. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
D. Contact finish is 0.1 μm (minimum) to 1.0 μm (maximum) of soft gold plated over a 15 μm (minimum) to 30 μm (maximum) thick
copper foil pattern with a 3 μm (minimum) to 15 μm (maximum) nickel barrier.
E. This package contains no lead (Pb).
F. This drawing is subject to change without notice.
Figure 26. Package CL — Six-Lead ChipLED Plastic Surface Mount Packaging Configuration