SEE NOTE 3
(4) PL.
OPTIONAL
GROUNDING TABS (40247)
AND SCREWS (40327) (2) PL.
SEE NOTE 2 AND DRAWING 39983
ISO ASSY REF ONLY
LONGITUDINAL FLOW
6123 CHIP SHOWN HERE
X-FLOW (XF)
(HEAT SINK ONLY SHOWN)
THERMAL
INTERFACE
MATERIAL
GROUND TABS
AND SCREWS
TORQUE M2 SCREWS
TO 2 IN-LB (.2 Nm)
BOTTOM VIEW
LONGITUDINAL FLOW (LF)
(HEAT SINK ONLY SHOWN)
OPTIONAL
GROUNDING TABS (40247)
AND SCREWS (40327) (2) PL.
SEE NOTE 2 AND DRAWING 39983
SEE NOTE 3
(4) PL.
ISO REF ONLY
19.000
.75
11.000
.43
APPLIES TO BOTH 11MM AND 19MM HEATSINKS
PUSH-PIN FOR CHIP HEATSINK CHART
NOTES:
FOR PCB LAYOUT SEE VICOR APPLICATION DRAWING 39983.
1.
THE SOLDERING METHOD USED FOR CHIPS (AND OPTIONAL HEATSINK GROUNDING)
2.
IS IMPORTANT WHEN SELECTING A THERMAL INTERFACE MATERIAL (TIM).
THE PHASE-CHANGE TIM SHOWN IN THESE ILLUSTRATIONS MAY BE DAMAGED BY
TEMPERATURES OVER 125C, SO TWO ASSEMBLY PROCEDURES ARE DESCRIBED BELOW:
(A) FOR HAND-SOLDERING ONLY,
(B) FOR WAVE-SOLDERING AND/OR HAND-SOLDERING.
(A) PLACE CHIP AND TOP-SIDE HEATSINK (WITH PRE-ATTACHED TIM AND GROUNDING TABS)
ON PCB. WHILE SUPPORTING PCB, INSERT PLASTIC PUSH-PINS THROUGH HEATSINK AND PCB.
(SELECT PROPER PUSH-PIN LENGTH FROM TABLE ON THIS DRAWING.)
HAND-SOLDER CHIP AND GROUNDING PINS.
(B) WAVE SOLDERING TEMPERATURES ARE UNSUITABLE FOR PLASTIC PUSH-PINS AND
PHASE-CHANGE TIM, SO VICOR TIM 40325 (PARKER CHOMERICS GEL8010) IS RECOMMENDED.
APPLY A UNIFORM .003” (.076MM) LAYER OF TIM 40325 TO THE TOP SURFACE OF THE CHIP,
OR TO THE BOTTOM SURFACE OF THE HEATSINK.
PLACE CHIP ON PCB AND TOP-SIDE HEATSINK ON CHIP.
WITH A CUSTOM FIXTURE APPLY APPROX. 10 LBS LOAD TO THE TOP-SIDE HEATSINK
AND THEN WAVE-SOLDER ALL PINS.
REMOVE FIXTURE AND, WHILE SUPPORTING PCB, INSERT PLASTIC PUSH-PINS THROUGH HEATSINK
AND PCB. (SELECT PROPER PUSH-PIN LENGTH FROM TABLE ON THIS DRAWING.)
CARE SHOULD BE TAKEN TO AVOID FULLY COMPRESSING THE PUSH-PIN SPRING DURING
3.
INSTALLATION AS THIS WOULD EXPOSE THE CHIP TO FORCES GREATER THAN THE RECOMMENDED
LIMIT OF 3.1 LBF (13.8 N) PER PUSH-PIN.
RoHS COMPLIANT PER CST-0001 LATEST REVISION.
4.
REV.
DESCRIPTION
INTL
DATE
APVD
1
RELEASED PER E140023a
GCK
01/13/2014
REW
PUSH-PINS
W/ SPRINGS
(100/BAG)
COLOR
PCB THK NOMINAL
RANGE
PCB THK
MINIMUM
PCB THK
MAXIMUM
32434
WHITE
1.143 MM TO 1.422 MM
[.045"] TO [.056"]
1.016 MM
[.040"]
1.575 MM
[.062"]
32435
BLACK
1.448 MM TO 2.311 MM
[.057"] TO [.091"]
1.295 MM
[.051"]
2.565 MM
[.101"]
32436
BLUE
2.337 MM TO 3.023 MM
[.092"] TO [.119"]
2.083 MM
[.082"]
3.353 MM
[.132"]
32437
GRAY
3.048 MM TO 3.607 MM
[.120"] TO [.142"]
2.743 MM
[.108"]
3.988 MM
[.157"]
HEATSINK TYPE
P/N HEATSINK ONLY
P/N HEATSINK
W/ TIM ONLY
P/N HEATSINK, TIM AND
GROUND TAB
P/N HEATSINK
W/GROUND TAB ONLY
SOLDERING
METHOD
(SEE NOTE 2)
-
2(B) WITH VICOR
40325 THERMAL GEL
2(A) HAND
SOLDER ONLY
2(A) HAND SOLDER
ONLY
2(B) WITH VICOR 40325
THERMAL GEL
4623
XF 11MM
39970 40492 40140 40482
LF 11MM
39969 40493 40144 40483
XF 19MM
40431
TBD
40531
TBD
LF 19MM
40432
TBD
40532
TBD
6123
XF 11MM
39972 40494 40141 40484
LF 11MM
39971 40495 40145 40485
XF 19MM
40406
TBD
40533
TBD
LF 19MM
40407
TBD
40534
TBD
2
F
7 2
F
7
3
B
8 4
6
C
8 4
A
5 3
C
D
A
VICOR CONFIDENTIAL
5
E
D
6
B
1
E
1
THIS DOCUMENT AND THE DATA DISCLOSED HEREIN OR
HEREWITH IS NOT TO BE REPRODUCED, USED OR
DISCLOSED IN WHOLE OR IN PART TO ANYONE WITHOUT
THE PERMISSION OF VICOR CORP.
SCALE
TOLERANCES ARE:
DECIMALS ANGLES
X.XX [X.X] = ±0.01 [0.25] ±1°
X.XXX [X.XX] = ±0.005 [0.127]
SHEET OF
SIZE
67131
CAGE CODE
40113
DWG NO
1
REV
DRAWN BY
DATE
Robert Wasik
07/24/2013
APP DWG, CHIP PUSHPIN
TOPSIDE HS, 6123, 4623
SWD
VICOR
THIRD ANGLE PROJECTION
DO NOT SCALE DRAWING
1
1
2:1
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE : INCH / [MM]
D
