Not for New Design - Alternative Available: New TSSP77038 (#82470)
TSOP77038
www.vishay.com
Vishay Semiconductors
Rev. 1.4, 28-Mar-12
5
Document Number: 82402
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKAGE DIMENSIONS in millimeters
ASSEMBLY INSTRUCTIONS
Reflow Soldering
• Reflow soldering must be done within 72 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Excercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handling after reflow should be done only after the work
surface has been cooled off
Manual Soldering
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
• Finish soldering within 3 s
• Handle products only after the temperature has cooled off
6.6 ± 0.1
3.2
1.27
3 x 1.27 = 3.81
(4 x)
2.2
(1)
1.2 ± 0.2
(2.2)
2.2
(3.4)
(R1.3)
2.5
0.5 ± 0.1
0.8
(1.8)
3
Pick and place area
Proposed pad layout
from component side
(for reference only)
technical drawings
according to DIN
specications
Not indicated tolerances ± 0.15
Drawing-No.: 6.550-5297.01-4
Issue: 4; 13.09.11
Marking area
Tool separation line
(0.635)
(1.65)
0.8
1.8
1.27
3 x 1.27 = 3.81
(3 x)
Mold residue
Mold residue
6.8
22608
