date 03/29/2017
page
1 of 3
cui.com
SERIES: HSS-B20-01 │ DESCRIPTION: HEAT SINK
FEATURES
• TO-220 package
• available with and without solder pin
• slide in style for easy component attachment
• black anodized finish
MODEL
solder pin thermal resistance
1
power
dissipation
1
orientation length
(mm)
@ 75°C ΔT,
nat conv
(°C/W)
@ 1 W,
nat conv
(°C/W)
@ 1 W,
200 LFM
(°C/W)
@ 1 W,
400 LFM
(°C/W)
@ 75°C ΔT,
nat conv
(W)
HSS-B20-061H horizontal 6.1 18.63 23.05 5.01 4.01 4.02
HSS-B20-0953H horizontal 9.53 18.63 23.05 5.01 4.01 4.02
HSS-B20-065V vertical 6.5 18.63 23.05 5.01 4.01 4.02
HSS-B20-NP no pin -- 18.63 23.05 5.01 4.01 4.02
Note: 1. See performance curves for full thermal resistance details.
PERFORMANCE CURVES
Mounting Surface Temperature
Rise Above Ambient (°C)
0
10
20
30
40
50
60
70
80
90
01 23
Heat Dissipated (W)
Without Airflow
200 LFM
400 LFM
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Power
(W)
Natural
Conv.
200 LFM 400 LFM
0 0 0 0
1 23.05 5.01 4.01
2 42.19 9.68 7.89
3 57.90 14.39 11.64
4 74.85 18.96 15.57
5 88.08 23.63 19.26
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
For more information, please visit the product page.