DATASHEET
BoardLevelCooling–ExtrudedHF
USA:1.855.322.2843 BoardLevelCooling
EUROPE:39.051.764002 www.aavid.com
ASIA:86.21.6115.2000x8122
MECHANICAL&PERFORMANCE
Drawingdimensionsareshowninmm,(in)
PartNumber “L”Dim “X”Dim “Y”Dim “Z”Dim
HF20G 20.0 10.49(0.413) 2.01(0.079) 1.55(0.061)
HF35G 35.0 17.98(0.708) 2.01(0.079) 1.55(0.061)
BOARDLEVELCOOLING‐ExtrudedHF
ExtrudedHFisaseriesofintegralspringboardlevelheatsinksdesignedto
coolTO‐220andTO‐220‐singlegaugedevices.Representativeimageonly.
ORDERINGINFORMATION
PartNumber DeviceType
HF20G TO‐220,TO‐220‐singlegauge
HF35G TO‐220,TO‐220‐singlegauge
HEATSINKDETAILS
Property Details
Material Aluminum
Finish BlackAnodize
DeviceAttachmentOptions IntegratedSpringClip
ThermalInterfaceMaterial ‐
Property Details
HeatSinkWidth(mm) 20.0
HeatSinkLength(mm) See“L”DimBelow
HeatSinkHeight(mm) 28.0
HeatSinkMountingDirection Vertical
MountingDetails: