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MPXV2202GC6U

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P19
MPX2202
Sensors
Freescale Semiconductor, Inc. 7
Pressure
PACKAGE DIMENSIONS
CASE 482A–01
ISSUE A
DATE 05/13/98
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 10.540.4250.415 10.79
B 10.540.4250.415 10.79
C 12.700.5200.500 13.21
D 0.960.0420.038 1.07
G 0.100 BSC 2.54 BSC
H 0.002 0.010 0.05 0.25
J 0.009 0.011 0.23 0.28
K 0.061 0.071 1.55 1.80
M 0 7 0 7
N 0.444 0.448 11.28 11.38
S 0.709 0.725 18.01 18.41
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5
TYPICAL DRAFT.
S
D
G
8 PL
4
5
8
1
S
B
M
0.25 (0.010) A
S
T
–A–
–B–
C
M
J
K
PIN 1 IDENTIFIER
H
SEATING
PLANE
–T–
N
V
W
V 0.245 0.255 6.22 6.48
W 0.115 0.125 2.92 3.17
MPX2202
Sensors
8 Freescale Semiconductor, Inc.
Pressure
NOTES:
1.
2.
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
D
4 PL
F
U
H
L
PORT #1
POSITIVE
PRESSURE
(P1)
PIN 1
-A-
-Q-
S
K
G
-P-
S
Q
M
0.25 (0.010)
T
S
S
M
0.13 (0.005)
Q
S
T
12 34
SEATING
PLANE
B
N
R
C
J
-T-
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 1.145 1.175 29.08 29.85
B 0.685 0.715 17.40 18.16
C 0.305 0.325 7.75 8.26
D 0.016 0.020 0.41 0.51
F 0.048 0.064 1.22 1.63
G 0.100 BSC 2.54 BSC
H 0.182 0.194 4.62 4.93
J 0.014 0.016 0.36 0.41
K 0.695 0.725 17.65 18.42
L 0.290 0.300 7.37 7.62
N 0.420 0.440 10.67 11.18
P 0.153 0.159 3.89 4.04
Q 0.153 0.159 3.89 4.04
R 0.230 0.250 5.84 6.35
S
U 0.910 BSC 23.11 BSC
0.220 0.240 5.59 6.10
CASE 344-15
ISSUE AA
UNIBODY PACKAGE
CASE 344B-01
ISSUE B
UNIBODY PACKAGE
PACKAGE DIMENSIONS
PACKAGE DIMENSIONS
MPX2202
Sensors
Freescale Semiconductor, Inc. 9
NOTES:
1.
2.
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
PORT #2
PORT #1
PORT #2
VACUUM
(P2)
(P1)
SEATING
PLANE
SEATING
PLANE
K
S
W
H
L
U
F
G
D
4 PL
PORT #1
POSITIVE PRESSURE
-Q-
12 43
PIN 1
-P-
-T- -T-
S
Q
M
0.25 (0.010) T
S
S
M
0.13 (0.005) Q
S
T
B
N
J
C
V
R
-A-
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 1.145 1.175 29.08 29.85
B 0.685 0.715 17.40 18.16
C 0.405 0.435 10.29 11.05
D 0.016 0.020 0.41 0.51
F 0.048 0.064 1.22 1.63
G 0.100 BSC 2.54 BSC
H 0.182 0.194 4.62 4.93
J 0.014 0.016 0.36 0.41
K 0.695 0.725 17.65 18.42
L 0.290 0.300 7.37 7.62
N 0.420 0.440 10.67 11.18
P 0.153 0.159 3.89 4.04
Q 0.153 0.159 3.89 4.04
R 0.063 0.083 1.60 2.11
S
U 0.910 BSC 23.11 BSC
V 0.248 0.278 6.30 7.06
W 0.310 0.330 7.87 8.38
0.220 0.240 5.59 6.10
CASE 344C-01
ISSUE B
UNIBODY PACKAGE
NOTES:
1.
2.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
CONTROLLING DIMENSION: INCH.
D
4 PL
F
U
L
H
PORT #2
VACUUM
(P2)
POSITIVE
PRESSURE
(P1)
PIN 1
-A-
-Q-
S
K
G
-P-
S
Q
M
0.25 (0.010) T
S
S
M
0.13 (0.005) Q
S
T
12 34
SEATING
PLANE
B
N
R
C
J
-T-
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 1.145 1.175 29.08 29.85
B 0.685 0.715 17.40 18.16
C 0.305 0.325 7.75 8.26
D 0.016 0.020 0.41 0.51
F 0.048 0.064 1.22 1.63
G 0.100 BSC 2.54 BSC
H 0.182 0.194 4.62 4.93
J 0.014 0.016 0.36 0.41
K 0.695 0.725 17.65 18.42
L 0.290 0.300 7.37 7.62
N 0.420 0.440 10.67 11.18
P 0.153 0.159 3.89 4.04
Q 0.153 0.158 3.89 4.04
R 0.230 0.250 5.84 6.35
S
U 0.910 BSC 23.11 BSC
0.220 0.240 5.59 6.10
CASE 344D-01
ISSUE B
UNIBODY PACKAGE
Pressure
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P19

MPXV2202GC6U

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Buy MPXV2202GC6U
Manufacturer:
NXP / Freescale
Description:
Board Mount Pressure Sensors SOP TEMP COMPENSATED
Lifecycle:
New from this manufacturer.
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