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NE521DR2G

P1-P3P4-P6P7-P7
NE521
http://onsemi.com
4
TYPICAL PERFORMANCE CHARACTERISTICS
20mV
5mV
10mV
4
3
2
1
0
100
50
0
0 5 10 15 20 25 30
V
S
= +5V
T
A
= 25
o
C
100mV
TIME — nS
INPUT VOLTAGE (mV) OUTPUT VOLTAGE (V)
T
A
= 25
o
C
V
S
= +5V
5mV
10mV100mV
50mV
0 5 10 15 20 25 30
TIME — nS
INPUT VOLTAGE (mV) OUTPUT VOLTAGE (V)
4
3
2
1
0
100
50
0
INPUT VOLTAGE (mVp−p)
PROPAGATION DELAY (ns)
V
S
= +5V
10MHz SQUARE
WAVE INPUT
T
A
= 25
o
C
TPD (LH)
TPD (HL)
10 20 30 40 50 60 70
12
10
8
6
20
18
16
14
12
10
8
6
4
2
100
1000
INPUT VOLTAGE (m Vp−p)
PROPAGATION DELAY (ns)
V
S
= +5V
10MHz SQUARE
WAVE INPUT
T
A
= 25
o
C
TPD (LH)
TPD (HL)
4.0
3.0
2.0
1.0
−75
−25
+25
+75
V
OL
V
OH
AMBIENT
TEMPERATURE
(
o
C)
OUTPUT VOLTAGE (V)
−75 −25 +25 +75 +125
AMBIENT TEMPERATURE (
o
C)
12
11
10
9
8
7
6
INPT BIAS CURRENT ( A)
μ
1.1
1.0
0.9
0.8
0.7
0.6
0.5
−75 −25 +25 +75 +125
AMBIENT TEMPERATURES (
o
C)
INPUT OFSET CURRENT ( A)
μ
12
10
8
6
4
2
60 20 −20 +60 +100 +140
TPD (LH)
TPD (HL)
AMBIENT TEMPERATURE (
o
C)
TESPONSE TIME (ns)
Figure 3. Response Time for
Various Input Overdrives
Figure 4. Response Time for
Various Input Overdrives
Figure 5. Response Time
vs. Temperature
Figure 6. Propagation Delay
for Various Input Voltages
Figure 7. Propagation Delay
for Various Input Voltages
Figure 8. Output Voltage vs.
Ambient Temperature
Figure 9. Input Bias Current
vs. Ambient Temperature
Figure 10. Input Offset
Current vs. Ambient
Temperature
+125
NE521
http://onsemi.com
5
ORDERING INFORMATION
Device Temperature Range Package Shipping
†
NE521D
0 to +70°C
SOIC−14
55 Units/Rail
NE521DG SOIC−14
(Pb−Free)
NE521DR2 SOIC−14
2500/Tape & Reel
NE521DR2G SOIC−14
(Pb−Free)
NE521N PDIP−14
25 Units/Rail
NE521NG PDIP−14
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
NE521
http://onsemi.com
6
PACKAGE DIMENSIONS
SOIC−14
CASE 751A−03
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
−A−
−B−
G
P 7 PL
14
8
7
1
M
0.25 (0.010) B
M
S
B
M
0.25 (0.010) A
S
T
−T−
F
R X 45
SEATING
PLANE
D 14 PL
K
C
J
M
_
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 8.55 8.75 0.337 0.344
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 5.80 6.20 0.228 0.244
R 0.25 0.50 0.010 0.019
__ _ _
7.04
14X
0.58
14X
1.52
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
7X
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
P1-P3P4-P6P7-P7

NE521DR2G

Mfr. #:
Buy NE521DR2G
Manufacturer:
ON Semiconductor
Description:
Analog Comparators Dual Diff Comparator Sense Amp
Lifecycle:
New from this manufacturer.
Delivery:
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