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PS2501AL-1-F3-K-A

P1-P3P4-P6P7-P9P10-P12
Normalized to 1.0
at T
A
= 25°C,
I
F
= 5 mA, V
CE
= 5 V
Ambient Temperature T
A
(°C)
Normalized Current Transfer Ratio CTR
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
Forward Current I
F
(mA)
Current Transfer Ratio CTR (%)
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
Frequency f (kHz)
Normalized Gain G
V
FREQUENCY RESPONSE
T
A
= 25
°
C
T
A
= 60
°
C
I
F
= 5 mA (TYP.)
1.2
1.0
0.8
0.6
0.4
0.2
0
10
2
10
3
10
4
10
5
Time (Hr)
CTR (Relative Value)
LONG TERM CTR DEGRADATION
Load Resistance R
L
(Ω)
Switching Time t ( s)
μ
SWITCHING TIME vs.
LOAD RESISTANCE
Load Resistance R
L
(kΩ)
SWITCHING TIME vs.
LOAD RESISTANCE
Switching Time t ( s)
μ
10
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
–
50
–
25 0 25 50 75 100
CTR:270%
CTR:130%
0
50
100
150
200
250
300
0.01 0.1 1 10
V
CE
= 5 V,
n = 3
100
B
C
Sample A
0.1
1
10
100
10 100 1 000 10 000
t
f
t
r
t
d
t
s
I
C
= 2 mA, V
CC
= 10 V,
CTR = 216%
1
10
100
1 000
1 10
t
r
100
t
d
t
s
t
f
I
F
= 5 mA, V
CC
= 5 V,
CTR = 216%
R
L
= 1 kΩ
300 Ω
100 Ω
I
F
= 5 mA,
V
CE
= 5 V
5
0
–
5
–
10
–
15
–
20
–
25
0.1 1
10
100 1 000
Remark The graphs indicate nominal characteristics.
Data Sheet PN10221EJ06V0DS
7
PS2501A-1,PS2501AL-1
TAPING SPECIFICATIONS (UNIT : mm)
Tape Direction
Outline and Dimensions (Tape)
Outline and Dimensions (Reel)
PS2501AL-1-F3
1.55±0.1
2.0±0.1
4.0±0.1
1.75±0.1
4.5 MAX.
4.0±0.1
0.4
5.3±0.1
8.0±0.1
7.5±0.1
16.0±0.3
10.3±0.1
1.5
+0.1
–0
φ
Packing: 2 000 pcs/reel
2.0±0.5
R 1.0
13.0±0.2
φ
21.0±0.8
φ
330±2.0
100±1.0
2.0±0.5
φ
φ
15.9 to 19.4
Outer edge of
flange
21.5±1.0
17.5±1.0
Data Sheet PN10221EJ06V0DS
8
PS2501A-1,PS2501AL-1
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature 260°C or below (package surface temperature)
• Time of peak reflow temperature 10 seconds or less
• Time of temperature higher than 220°C 60 seconds or less
• Time to preheat temperature from 120 to 180°C 120±30 s
• Number of reflows Three
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
120±30 s
(preheating)
220°C
180°C
Package Surface Temperature T (°C)
Time (s)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
to 60 s
260°C MAX.
120°C
(2) Wave soldering
• Temperature 260°C or below (molten solder temperature)
• Time 10 seconds or less
• Preheating conditions 120°C or below (package surface temperature)
• Number of times One (Allowed to be dipped in solder including plastic mold portion.)
• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
• Peak temperature (lead part temperature) 350°C or below
• Time (each pins) 3 seconds or less
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
Data Sheet PN10221EJ06V0DS
9
PS2501A-1,PS2501AL-1
P1-P3P4-P6P7-P9P10-P12

PS2501AL-1-F3-K-A

Mfr. #:
Buy PS2501AL-1-F3-K-A
Manufacturer:
CEL
Description:
Transistor Output Optocouplers BV= 5000Vr.m.s. Creep 7mm Min.
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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