BBA-519-A

TYPICAL APPLICATIONS
The schematic in the figure below shows a typical configuration for amplifying the
output of a transmitter.
In this circuit, the BBA-519-A amplifies the output of the ES Series transmitter.
The transmitter operates on 3V while the amplifier requires 5V, so a 270Ω
resistor is used to drop the 5V supply to 3V for the transmitter.
This configuration would result in a 6 to 7 times increase in system range. Note
that such output levels may render the transmitter illegal for operation in certain
countries, so it is up to the designer to ensure that the product will comply with
the appropriate regulations.
Page 7Page 6
BBA-
5
1
9
-
A
G
N
D
G
N
D
G
N
D
G
N
D
RF IN
RF
OUT
G
N
D
1
4
5
6
7
8
TXM-xxx-E
S
PDN
V
CC
L
O
V
D
/C
LK
SE
/C
L
K
G
N
D
ANT
G
N
D
1
3
4
6
7
8
9
1
0
V
CC
G
N
D
TX DATA
G
N
D
G
N
D
V
CC
27
0
Ω
Figure 6: Typical Application Circuit
POWER SUPPLY REQUIREMENTS
The module does not have an internal voltage
regulator; therefore it requires a clean, well-regulated
power source. While it is preferable to power the unit
from a battery, the unit can also be operated from a
power supply as long as noise is less than 20mV.
Power supply noise can significantly affect the
performance; therefore, providing a clean power
supply for the module should be a high priority during
design.
A 10Ω resistor in series with the supply followed by a 10µF tantalum capacitor
from V
CC
to ground will help in cases where the quality of supply power is poor.
These values may need to be adjusted depending on the noise present on the
supply line.
The power supply must be regulated to within the primary range specified or the
maximum current limited using an appropriate resistance in series with the
amplifier’s positive supply pin. Failure to observe the supply limits will irreparably
damage the device. The resistor should be selected so that the device current is
limited to or less than the maximum rated current. The resistor value may be
easily selected using the following formula:
+
10Ω
10μF
Vcc IN
Vcc TO
MODULE
R =
V
SUPPLY
- V
DEVICE TYP.
I
CC
Example:
BBA-519-A @ 9V Supply
R =
9 - 5
60x10
-3
9 - 5
60x10
-3
==
4
0.06
= 66Ω
Figure 5: Supply Filter
BOARD LAYOUT GUIDELINES
If you are at all familiar with RF devices, you may be concerned about
specialized board layout requirements. Fortunately, because of the care taken by
Linx in designing the modules, integrating them is very straightforward. Despite
this ease of application, it is still necessary to maintain respect for the RF stage
and exercise appropriate care in layout and application in order to maximize
performance and ensure reliable operation. The antenna can also be influenced
by layout choices. Please review this data guide in its entirety prior to beginning
your design. By adhering to good layout principles and observing some basic
design rules, you will be on the path to RF success.
The adjacent figure shows the suggested
PCB footprint for the module. The actual pad
dimensions are shown in the Pad Layout
section of this manual. A ground plane (as
large as possible) should be placed on a
lower layer of your PC board opposite the
module. This ground plane can also be critical
to the performance of your antenna, which will
be discussed later. There should not be any
ground or traces under the module on the
same layer as the module, just bare PCB.
During prototyping, the module should be soldered to a properly laid-out circuit
board. The use of prototyping or “perf” boards will result in horrible performance
and is strongly discouraged.
No conductive items should be placed within 0.15in of the module’s top or sides.
Do not route PCB traces directly under the module. The underside of the module
has numerous signal-bearing traces and vias that could short or couple to traces
on the product’s circuit board.
The module’s ground lines should each have their own via to the ground plane
and be as short as possible.
The module should, as much as reasonably possible, be isolated from other
components on your PCB, especially high-frequency circuitry such as crystal
oscillators, switching power supplies, and high-speed bus lines. Make sure
internal wiring is routed away from the module and antenna, and is secured to
prevent displacement.
The power supply filter should be placed close to the module’s V
CC
line.
In some instances, a designer may wish to encapsulate or “pot” the product.
Many Linx customers have done this successfully; however, there are a wide
variety of potting compounds with varying dielectric properties. Since such
compounds can considerably impact RF performance, it is the responsibility of
the designer to carefully evaluate and qualify the impact and suitability of such
materials.
The trace from the module to the antenna should be kept as short as possible.
A simple trace is suitable for runs up to 1/8-inch for antennas with wide
bandwidth characteristics. For longer runs or to avoid detuning narrow bandwidth
antennas, such as a helical, use a 50-ohm coax or 50-ohm microstrip
transmission line as described in the following section.
Page 9Page 8
GROUND PLANE
GROUND PLANE
ON LOWER LAYER
ON LOWER LAYER
GROUND PLANE
ON LOWER LAYER
Figure 7: Suggested PCB Layout
Dielectric Constant Width/Height (W/d)
Effective Dielectric
Constant
Characteristic
Impedance
4.80 1.8 3.59 50.0
4.00 2.0 3.07 51.0
2.55 3.0 2.12 48.0
Trace
Board
Ground plane
Figure 8: Microstrip Formulas
MICROSTRIP DETAILS
A transmission line is a medium whereby RF energy is transferred from one
place to another with minimal loss. This is a critical factor, especially in high-
frequency products like Linx RF modules, because the trace leading to the
module’s antenna can effectively contribute to the length of the antenna,
changing its resonant bandwidth. In order to minimize loss and detuning, some
form of transmission line between the antenna and the module should be used,
unless the antenna can be placed very close (<1/8in.) to the module. One
common form of transmission line is a coax cable, another is the microstrip. This
term refers to a PCB trace running over a ground plane that is designed to serve
as a transmission line between the module and the antenna. The width is based
on the desired characteristic impedance of the line, the thickness of the PCB,
and the dielectric constant of the board material. For standard 0.062in thick FR-
4 board material, the trace width would be 111 mils. The correct trace width can
be calculated for other widths and materials using the information below. Handy
software for calculating microstrip lines is also available on the Linx website,
www.linxtechnologies.com.
Page 11Page 10
PAD LAYOUT
The following pad layout diagram is designed to facilitate both hand and
automated assembly.
PRODUCTION GUIDELINES
The modules are housed in a hybrid SMD package that supports hand or
automated assembly techniques. Since the modules contain discrete
components internally, the assembly procedures are critical to ensuring the
reliable function of the modules. The following procedures should be reviewed
with and practiced by all assembly personnel.
HAND ASSEMBLY
Pads located on the bottom of the
module are the primary mounting
surface. Since these pads are
inaccessible during mounting,
castellations that run up the side of
the module have been provided to
facilitate solder wicking to the
module’s underside. This allows for
very quick hand soldering for
prototyping and small volume
production.
If the recommended pad guidelines have been followed, the pads will protrude
slightly past the edge of the module. Use a fine soldering tip to heat the board
pad and the castellation, then introduce solder to the pad at the module’s edge.
The solder will wick underneath the module, providing reliable attachment. Tack
one module corner first and then work around the device, taking care not to
exceed the times listed below.
Castellations
PCB Pads
Soldering Iron
Tip
Solder
Absolute Maximum Solder Times
Hand-Solder Temp. TX +225°C for 10 Seconds
Hand-Solder Temp. RX +225°C for 10 Seconds
Recommended Solder Melting Point +180°C
Reflow Oven: +220°C Max. (See adjoining diagram)
Figure 10: Soldering Technique
0.100"
0.070"
0.065"
0.340"
Figure 9: Recommended PCB Layout
AUTOMATED ASSEMBLY
For high-volume assembly, most users will want to auto-place the modules. The
modules have been designed to maintain compatibility with reflow processing
techniques; however, due to the their hybrid nature, certain aspects of the
assembly process are far more critical than for other component types.
Following are brief discussions of the three primary areas where caution must be
observed.
Reflow Temperature Profile
The single most critical stage in the automated assembly process is the reflow
stage. The reflow profile below should not be exceeded, since excessive
temperatures or transport times during reflow will irreparably damage the
modules. Assembly personnel will need to pay careful attention to the oven’s
profile to ensure that it meets the requirements necessary to successfully reflow
all components while still remaining within the limits mandated by the modules.
The figure below shows the recommended reflow oven profile for the modules.
Shock During Reflow Transport
Since some internal module components may reflow along with the components
placed on the board being assembled, it is imperative that the modules not be
subjected to shock or vibration during the time solder is liquid. Should a shock
be applied, some internal components could be lifted from their pads, causing
the module to not function properly.
Washability
The modules are wash resistant, but are not hermetically sealed. Linx
recommends wash-free manufacturing; however, the modules can be subjected
to a wash cycle provided that a drying time is allowed prior to applying electrical
power to the modules. The drying time should be sufficient to allow any moisture
that may have migrated into the module to evaporate, thus eliminating the
potential for shorting damage during power-up or testing. If the wash contains
contaminants, the performance may be adversely affected, even after drying.
125°C
185°C
217°C
255°C
235°C
60 12030 150 180 210 240 270 300 330 360090
50
100
150
200
250
300
Recommended RoHS Profile
Max RoHS Profile
Recommended Non-RoHS Profile
180°C
Temperature (
o
C)
Time (Seconds)
Figure 11: Maximum Reflow Profile

BBA-519-A

Mfr. #:
Manufacturer:
Linx Technologies
Description:
RF Amplifier High-Power Broadband RF AMP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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