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PLA134STR

P1-P3P4-P6P7-P7
I
NTEGRATED
C
IRCUITS
D
IVISION
www.ixysic.com
4
R05
PLA134
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
Turn-On Time (ms)
-40
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-20 0 20 40 60 80 100
Typical Turn-On Time
vs. Temperature
(I
F
=5mA, I
L
=200mA
DC
)
Temperature (ºC)
Turn-Off Time (ms)
-40
0.11
0.10
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0
-20 0 20 40 60 80 100
Typical Turn-Off Time
vs. Temperature
(I
F
=5mA, I
L
=200mA
DC
)
Temperature (ºC)
-40
6
5
4
3
2
1
0
-20 0 20 40 60 80 100
I
F
=5mA Instantaneous
I
F
=5mA
I
F
=10mA
Typical On-Resistance vs. Temperature
AC/DC Configuration
(I
L
=350mA
DC
)
Temperature (ºC)
On-Resistance (:)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Temperature (ºC)
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=200mA
DC
)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=200mA
DC
)
Temperature (ºC)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Temperature (ºC)
On-Resistance (:)
Typical On-Resistance vs. Temperature
DC-Only Configuration
(I
L
=350mA
DC
)
I
F
=10mA
I
F
=5mA
Load Voltage (V)
Load Current (mA)
400
300
200
100
0
-100
-200
-300
-400
-1.5
-1.0 -0.5 0 0.5 1.0
1.5
Typical Load Current vs. Load Voltage
(I
F
=5mA)
Load Current (mA)
600
500
400
300
200
100
0
-40 -20 0 20 40 60 80 120100
Maximum Load Current
vs. Temperature
AC/DC Configuration
Temperature (ºC)
I
F
=10mA
I
F
=5mA
Load Current (mA)
900
800
700
600
500
400
300
200
100
0
Maximum Load Current
vs. Temperature
DC Configuration
-40 -20 0 20 40 60 80 120100
I
F
=5mA
I
F
=10mA
Temperature (ºC)
Blocking Voltage (V
P
)
-40
175
150
125
100
75
50
25
0
-20 0 20 40 60 80 100
Temperature (ºC)
Typical Blocking Voltage
vs. Temperature
Leakage (PA)
-40
0.018
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-20 0 20 40 60 80 100
Typical Leakage vs. Temperature
Measured Across Pins 4&6
Temperature (ºC)
Time
Load Current (A)
2.4
2.0
1.6
1.2
0.8
0.4
0
10Ps 1ms 100ms 10s100Ps 10ms 1s 100s
Energy Rating Curve
I
NTEGRATED
C
IRCUITS
D
IVISION
PLA134
www.ixysic.com
5
R05
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
PLA134 / PLA134S MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
PLA134 / PLA134S 250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
e
3
Pb
I
NTEGRATED
C
IRCUITS
D
IVISION
www.ixysic.com
6
R05
PLA134
Dimensions
mm
(inches)
PCB Hole Pattern
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
0.254 ± 0.0127
(0.010 ± 0.0005)
9.144 ± 0.508
(0.360 ± 0.020)
7.239 TYP
(0.285 TYP)
7.620 ± 0.254
(0.300 ± 0.010)
3.302 ± 0.051
(0.130 ± 0.002)
4.064 TYP
(0.160 TYP)
0.457 ± 0.076
(0.018 ± 0.003)
8.382 ± 0.381
(0.330 ± 0.015)
2.54 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
1.651 ± 0.254
(0.065 ± 0.010)
Pin 1
Dimensions
mm
(inches)
PCB Land Pattern
0.254 ± 0.0127
(0.010 ± 0.0005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
4.445 ± 0.254
(0.175 ± 0.010)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
8.382 ± 0.381
(0.330 ± 0.015)
2.54 ± 0.127
(0.100 ± 0.005)
9.524 ± 0.508
(0.375 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
1.651 ± 0.254
(0.065 ± 0.010)
1.651 ± 0.254
(0.065 ± 0.010)
Pin 1
PLA134
PLA134S
Mechanical Dimensions
P1-P3P4-P6P7-P7

PLA134STR

Mfr. #:
Buy PLA134STR
Manufacturer:
IXYS Integrated Circuits
Description:
Solid State Relays - PCB Mount Single-Pole Relay 100V 350mA
Lifecycle:
New from this manufacturer.
Delivery:
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