ADR512W
Rev. 0 | Page 4 of 12
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Reverse Current 25 mA
Forward Current 20 mA
Storage Temperature Range
RT Package −65°C to +150°C
Operating Temperature Range −40°C to +85°C
Junction Temperature Range
RT Package −65°C to +150°C
Lead Temperature Range (Soldering, 60 Sec) 300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
1
θ
JA
2
θ
JC
Unit
3-SOT-23 (RT) 230 146 °C/W
1
Package power dissipation = (T
JMAX
− T
A
)/θ
JA
.
2
θ
JA
is specified for worst-case conditions; that is., θ
JA
is specified for the device
soldered.
ESD CAUTION
