P3P18S19BF-08SR

© Semiconductor Components Industries, LLC, 2015
February, 2015 − Rev. 1
1 Publication Order Number:
P3P18S19B/D
P3P18S19B
Notebook LCD Panel EMI
Reduction IC
Product Description
The P3P18S19B is a Versatile Spread Spectrum Frequency
Modulator designed specifically for input clock frequencies from 20
to 40 MHz. (Refer to “Input Frequency and Modulation Rate” Table).
The P3P18S19B reduces electromagnetic interference (EMI) at the
clock source, allowing system wide reduction of EMI of downstream
clock and data dependent signals. The P3P18S19B allows significant
system cost savings by reducing the number of circuit board layers,
ferrite beads, shielding, and other passive components that are
traditionally required to pass EMI regulations.
The P3P18S19B modulates the output of a single PLL in order to
“spread” the bandwidth of a synthesized clock, and more importantly,
decreases the peak amplitudes of its harmonics. This results in
significantly lower system EMI compared to the typical narrow band
signal produced by oscillators and most frequency generators.
Lowering EMI by increasing a signal’s bandwidth is called ‘Spread
Spectrum Clock Generation’.
The P3P18S19B uses the most efficient and optimized modulation
profile approved by the FCC and is implemented in a proprietary all
digital method.
Applications
The P3P18S19B is targeted towards EMI management for memory
and LVDS interfaces in mobile graphic chipsets and high−speed
digital applications such as PC peripheral devices, consumer
electronics, and embedded controller systems.
Features
FCC Approved Method of EMI Attenuation
Provides up to 15 dB EMI Reduction
Generates a Low EMI Spread Spectrum Clock and a Non−spread
Reference Clock of the Input Frequency
Optimized for Frequency Range from 20 to 40 MHz
Internal Loop Filter Minimizes External Components and Board
Space
Low Inherent Cycle−to−Cycle Jitter
Two Spread % Selections: −1.25% to −1.75%
3.3 V Operating Voltage
CMOS Design
Supports Notebook VGA and other LCD Timing Controller
Applications
Power Down Function for Mobile Application
Available in 8−pin SOIC Package
These Devices are Pb−Free and are RoHS Compliant
www.onsemi.com
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
ORDERING INFORMATION
SOIC−8 NB
CASE 751
PIN CONFIGURATION
1
2
3
45
6
7
8
P3P18S19B
VDD
PD#
XOUT
REF
XIN / CLKIN
VSS
SRS
ModOUT
1
8
MARKING DIAGRAM
ABS = Specific Device Code
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = Pb−Free Package
ABS
ALYWX
G
1
8
P3P18S19B
www.onsemi.com
2
Block Diagram
Figure 1. Block Diagram
VSS
VDD
ModOUT
XIN/CLKIN
Frequency
Divider
Feedback
Divider
Modulation
Phase
Detector
Loop
Filter
VCO
PLL
SRS
PD#
XOUT
REF
Crystal
Oscillator
Output
Divider
Table 1. PIN DESCRIPTION
Pin # Pin Name Type Description
1 XIN / CLKIN I Crystal Connection or external frequency input. This pin has dual functions. It can be
connected to either an external crystal or an external reference clock.
2 VSS P Ground Connection. Connect to system ground.
3 SRS I Spread range select. Digital logic input used to select frequency deviation (Refer to Spread
Deviation Selection Table). This pin has an internal pullup resistor.
4 ModOUT O Spread spectrum clock output. (Refer to Input Frequency and Modulation Rate Table and
Spread Deviation Selection Table)
5 REF O Non−modulated Reference clock output of the input frequency.
6 PD# I Power down control pin. Pull LOW to enable Power−Down mode. This pin has an internal
pull−up resistor.
7 VDD P Power Supply for the entire chip.
8 XOUT O Crystal Connection. Input connection for an external crystal. If using an external reference,
this pin must be left unconnected.
Table 2. INPUT FREQUENCY AND MODULATION RATE
Part Number Input Frequency Range Output Frequency Range Modulation Rate
P3P18S19B 20 MHz to 40 MHz 20 MHz to 40 MHz Input Frequency / 512
Table 3. SPREAD DEVIATION SELECTION
Part Number SRS Spread Deviation
P3P18S19B
0 −1.25% (DOWN)
1 −1.75% (DOWN)
P3P18S19B
www.onsemi.com
3
Table 4. ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Rating Unit
VDD, V
IN
Voltage on any pin with respect to Ground −0.5 to +4.6 V
T
STG
Storage temperature −65 to +125 °C
T
s
Max. Soldering Temperature (10 sec) 260 °C
T
J
Junction Temperature 150 °C
T
DV
Static Discharge Voltage (As per JEDEC STD22− A114−B) 2 KV
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
Table 5. DC ELECTRICAL CHARACTERISTICS
Symbol Parameter Min Typ Max Unit
V
IL
Input Low voltage VSS – 0.3 0.8 V
V
IH
Input High voltage 2.0 VDD + 0.3 V
I
IL
Input Low current (inputs PD#, SRS) −60.0 −20.0
mA
I
IH
Input High current 1.0
mA
I
XOL
X
OUT
Output low current @ 0.4 V, VDD = 3.3 V 3 mA
I
XOH
X
OUT
Output high current @ 2.5 V, VDD = 3.3 V 3 mA
V
OL
Output Low voltage VDD = 3.3 V, I
OL
= 20 mA 0.4 V
V
OH
Output High voltage VDD = 3.3 V, I
OH
= 20 mA 2.5 V
I
CC
Dynamic supply current normal mode
3.3 V and 25 pF probe loading
7.1
f
IN
min
26.9
f
IN
max
mA
I
DD
Static supply current standby mode 4.5 mA
V
DD
Operating Voltage 3.3 V
t
ON
Power up time (first locked clock cycle after power up) 0.18 mS
Z
OUT
Clock Output impedance 50
W
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
Table 6. AC ELECTRICAL CHARACTERISTICS
Symbol Parameter Min Typ Max Unit
f
IN
Input Frequency 20 40 MHz
f
OUT
Output Frequency 20 40 MHz
t
LH
* Output Rise time (Measured from 0.8 V to 2.0 V) 0.66 nS
t
HL
* Output Fall time (Measured from 2.0 V to 0.8 V) 0.65 nS
t
JC
Jitter (Cycle−to−cycle) −200 200 pS
t
D
Output Duty cycle 45 50 55 %
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
* t
LH
and t
HL
are measured into a capacitive load of 15 pF
Table 7. ORDERING INFORMATION
Part Number Marking Package Type Temperature
P3P18S19BF−08SR ABS 8 pin SOIC, TAPE & REEL, Pb Free 0°C to +70°C
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm.

P3P18S19BF-08SR

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Clock Generators & Support Products 20-40MHZ 3.3V GP EMI
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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