Spec No. JELF243B-0022K-01 P3/9
MURATA MFG.CO., LTD
Reference
Only
7. Mechanical Performance
No. Item Specification Test Method
7.1 Shear Test Chip coil shall not be damaged after
tested as follows.
Applied Direction
Force: 10N
Hold Duration: 5s±1s
Applied Direction: Parallel to PCB
7.2 Bending Test
Substrate: Glass-epoxy substrate
(100mm×40mm×1.0mm)
Solder: Reflow
(in mm)
Speed of Applying Force: 0.5mm / s
Deflection: 3mm
Hold Duration: 30 s
7.3 Vibration Oscillation Frequency:
10Hz to 2000Hz to 10Hz for 20 min
Total amplitude 3.0 mm or Acceleration
amplitude 245m/s
2
whichever is smaller.
Testing Time:
A period of 4h in each of 3 mutually
perpendicular directions.
7.4 Drop It shall be dropped on concrete or steel
board.
Method : free fall
Height : 1m
Total of 10 cycles
7.5 Solderability The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C / 60s to 90s
Solder Temperature: 240°C±5°C
Immersion Time: 3s±1s
7.6 Resistance to
Soldering Heat
Appearance: No damage
Inductance Change: within ±30%
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C / 60s to 90s
Solder Temperature: 270°C±5°C
Immersion Time: 10s±1s
Then measured after exposure in the room
condition for 24h±2h.
F
Chip Coil
Substrate
F
Pressure jig
Deflection
Product
R230
45
45