LQM2MPN2R2MG0L Datasheet LQM2MPN3R3NG0L, LQM2MPN4R7NG0L, LQM2MPN1R5MG0L | P1-P3

Spec No. JELF243B-0022K-01 P1/9

MURATA MFG.CO., LTD

Reference

Only

Operating Temperature (°C)

85 125

Rated Current (A)

at 85°C

Rated current

at 125°C

Rated current

CHIP COIL (CHIP INDUCTORS) LQM2MPN□□□□G0L REFERENCE SPECIFICATION

1. Scope

This reference specification applies to LQM2MPN_G0L series, Chip Coil (Chip Inductors).

2. Part Numbering

(ex) LQ M 2M P N R47 M G 0 L

Product ID Structure Dimension Applications Category Inductance Tolerance Dimension Other Packaging

(L×W) and (T)

L:Taping

Characteristics

*B:BULK

*B:Bulk packing also available

3. Rating

・Operating Temperature Range – 55°C to + 125°C

・Storage Temperature Range – 55°C to + 125°C

Customer

Part Number

MURATA

Part Number

Inductance

Resistance

(Ω)

Self

Resonant

Frequency

(MHz min.)

Rated Current

(A)

(μH) Tolerance

Typ Max 85℃

125℃

LQM2MPNR47MG0L

0.47

M：±20%

N：±30%

0.060 0.075 100 1.6 1.2

LQM2MPNR47NG0L

LQM2MPN1R0NG0L 1.0 N：±30% 0.085 0.107 60 1.4 1.0

LQM2MPN1R5MG0L

1.5

M：±20%

N：±30%

0.11 0.138 50 1.2 0.9

LQM2MPN1R5NG0L

LQM2MPN2R2MG0L

2.2

M：±20%

N：±30%

0.11 0.138 40 1.2 0.9

LQM2MPN2R2NG0L

LQM2MPN3R3NG0L 3.3

N：±30%

0.12 0.15 30 1.2 0.9

LQM2MPN4R7MG0L

4.7

M：±20%

N：±30%

0.14 0.175 20 1.1 0.8

LQM2MPN4R7NG0L

*1 When applied Rated current to the Products, temperature rise caused by self-generated heat shall be limited to

40 ℃ max

*2 Rated Current is derated as right figure

depending on the operating temperature.

4. Testing Conditions

《Unless otherwise specified》《In case of doubt》

Temperature : Ordinary Temperature / 15°C to 35°C Temperature : 20°C ± 2°C

Humidity

: Ordinary Humidity / 25%(RH) to 85%(RH) Humidity : 60%(RH) to 70%(RH)

Atmospheric Pressure : 86kPa to 106kPa

Spec No. JELF243B-0022K-01 P2/9

MURATA MFG.CO., LTD

Reference

Only

0.5±0.2

2.0±0.15

1.6±0.15

0.9±0.1

5. Appearance and Dimensions

■Unit Mass (Typical value)

0.012g

(in mm)

6. Electrical Performance

No. Item Specification Test Method

6.1 Inductance

Inductance shall meet item 3. Measuring Equipment:

Agilent 4294A or quivalent (1mA)

Measuring Frequency: 1MHz

6.2 DC Resistance DC Resistance shall meet item 3. Measuring Equipment: Digital multi meter

DC resistance shall be measured after

putting chip coil between the terminal 2

under the condition of opening between

a and b.

Every measurement the terminal 1 shall

be shorted between a and b when

changing chip coil.

6.3 Self Resonant

Frequency

(S.R.F)

S.R.F shall meet item 3. Measuring Equipment:

Agilent 4294A or equivalent

6.4 Rated Current Self temperature rise shall be

limited to 40°C max.

The rated current is applied.

Digital multi meter

(TR6846 or equivalent)

terminal2terminal1

Spec No. JELF243B-0022K-01 P3/9

MURATA MFG.CO., LTD

Reference

Only

7. Mechanical Performance

No. Item Specification Test Method

7.1 Shear Test Chip coil shall not be damaged after

tested as follows.

Applied Direction

Force: 10N

Hold Duration: 5s±1s

Applied Direction: Parallel to PCB

7.2 Bending Test

Substrate: Glass-epoxy substrate

(100mm×40mm×1.0mm)

Solder: Reflow

(in mm)

Speed of Applying Force: 0.5mm / s

Deflection: 3mm

Hold Duration: 30 s

7.3 Vibration Oscillation Frequency:

10Hz to 2000Hz to 10Hz for 20 min

Total amplitude 3.0 mm or Acceleration

amplitude 245m/s

whichever is smaller.

Testing Time:

A period of 4h in each of 3 mutually

perpendicular directions.

7.4 Drop It shall be dropped on concrete or steel

board.

Method : free fall

Height : 1m

Total of 10 cycles

7.5 Solderability The wetting area of the electrode

shall be at least 90% covered with

new solder coating.

Flux: Ethanol solution of rosin 25(wt)%

(Immersed for 5s to 10s)

Solder: Sn-3.0Ag-0.5Cu

Pre-Heating: 150°C±10°C / 60s to 90s

Solder Temperature: 240°C±5°C

Immersion Time: 3s±1s

7.6 Resistance to

Soldering Heat

Appearance: No damage

Inductance Change: within ±30%

Flux: Ethanol solution of rosin 25(wt)%

(Immersed for 5s to 10s)

Solder: Sn-3.0Ag-0.5Cu

Pre-Heating: 150°C±10°C / 60s to 90s

Solder Temperature: 270°C±5°C

Immersion Time: 10s±1s

Then measured after exposure in the room

condition for 24h±2h.

Chip Coil

Substrate

Pressure jig

Deflection

Product

R230

P1-P3 P4-P6 P7-P9

LQM2MPN2R2MG0L

Mfr. #:

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Manufacturer:

Description:

Fixed Inductors 0806 2.2uH 20%

Lifecycle:

New from this manufacturer.

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LQM2MPN2R2MG0L

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