EK13
EK13U Rev H 3
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PARTS LIST
ASSEMBLY
The PA341DF/PA441DF is a surface mount device and should be assembled to the EVAL15 PC board using
surface mount processes. Solder paste may be dispensed or screen-printed on the DUT pads. The heat tab on
the back of the PA341DF/PA441DF provides maximum heat dissipation capabilities when soldered to the PCB
metalization that runs under the DUT on the DUT side of the board. Solder should be applied here also. For
prototype purposes, the tab can be thermally connected to the PCB metalization using thermal grease.
The PA341DF/PA441DF and HS24 should be reflowed to the PCB using a solder reflow furnace. If this is
not available, a heat plate capable of solder reflow temperatures may be used. or, though time consuming,
the leads may be soldered individually to the PCB with a soldering iron. In this case the use of thermal grease
under the heat tab is recommended instead of solder for the thermal connection.
High Voltages will be present. Use caution in handling and probing when power is applied.
Reference Part # Description
QTY
EVAL15 PC Board 1
C1, C2 1825B105K201N Cap, 1µF, 200V, 10%-R 2
HS24 Heatsink 1
