052218 115
F97-HT3 Series
High Temperature 135°C, Resin-molded Chip, High Reliability
TEST
F97-HT3 series (Temperature range -55°C to +135°C)
Condition
At 85°C, 85% RH For 1000 hours (No voltage applied)
Capacitance Change....Refer to page 114 (*1)
Dissipation Factor .... Initial speci ed value or less
Leakage Current .... 125% or less than the initial specified value
After 1000 hours application of rated voltage in series with a 33Ω resistor at 85°C, 85% RH capacitors
meet the characteristics requirements table below.
Capacitance Change ...Refer to page 114 (*1)
Dissipation Factor ........120% or less than the Initial specified value
Leakage Current...........200% or less than the initial specified value
At -55°C / +135°C,For 30 minutes each,1000 cycles
Capacitance Change ...Refer to page 114 (*1)
Dissipation Factor ........Initial specified value or less
Leakage Current...........Initial specified value or less
10 seconds reow at 260°C, 5 seconds immersion at 260°C.
Capacitance Change ...Refer to page 114 (*1)
Dissipation Factor ........Initial specified value or less
Leakage Current...........Initial specified value or less
After immersing capacitors completely into a solder pot at 245°C for 2 to 3 seconds, more than 3/4 of their electrode
area shall remain covered with new solder.
After application of surge in series with a 33Ω resistor at the rate of 30 seconds ON, 30 seconds OFF,for 1000
successive test cycles at 95°C,capacitors shall meet the characteristic requirements table below.
Capacitance Change ...Refer to page 114 (*1)
Dissipation Factor ........Initial specified value or less
Leakage Current...........Initial specified value or less
After 2000 hours application of rated voltage in series with a 3Ω resistor at 95°C,or derated voltage in series with a
3Ω resistor at 135°C,capacitors shall meet the characteristic requirements table below.
Capacitance Change ...Refer to page 114 (*1)
Dissipation Factor ........Initial specified value or less
Leakage Current...........Initial specified value or less
After applying the pressure load of 17.7N for 60 seconds horizontally to the center of capacitor side
body which has no electrode and has been soldered beforehand on a substrate, there shall be found
neither exfoliation nor its sign at the terminal electrode.
Keeping a capacitor surface-mounted on a substrate upside down and supporting the substrate at
both of the opposite bottom points 45mm apart from the center of capacitor, the pressure strength
is applied with a specified jig at the center of the substrate so that substrate may bend by 1mm as
illustrated. Then, there shall be found no remarkable abnormality on the capacitor terminals.
QUALIFICATION TABLE
Damp Heat
(Steady State)
Load Humidity
Temperature
Cycles
Resistance to
Soldering Heat
Solderability
Surge*
Endurance*
Shear Test
Terminal
Strength
* As for the surge voltage and derated voltage at 135°C, refer to page precautions for details.
