AFBR-5972BZ Datasheet AFBR-5972BZ | P1-P3

AFBR-5972EZ, AFBR-5972BZ

Compact 650nm Transceiver with Compact Versatile

Link Connector for Fast Ethernet over POF

Data Sheet

Description

The AFBR-5972xZ transceivers provide system designers

with the ability to implement Fast Ethernet (100 Mbps)

over standard bandwidth 0.5±0.05 NA POF. The new com-

pact Versatile-Link duplex connector is compatible with

existing simplex Versatile-Link connectors and features

a very compact design with a form factor similar to the

UTP connector. To enable easy visual di erentiation the

AFBR-5972EZ uses standard black port color while the

AFBR-5972BZ has a blue colored port. The AFBR-5972xZ

transceivers are lead free and compliant with RoHS.

Transmitter

The transmitter contains a 650nm LED with a driver IC. The

LED driver operates at 3.3V. It receives an LVDS electrical

input, and converts it into a modulated current driving the

LED. IC and LED are packaged in an optical subassembly,

part of the transmitter section. The optical subassembly

couples the output optical power e ciently into POF  -

ber.

Receiver

The receiver utilizes an ampli er/quantizer IC with an inte-

grated double photodiode. The IC is packaged in an opti-

cal sub-assembly, part of the receiver section. This optical

subassembly couples the optical power e ciently from

POF  ber to the receiving photodiode. The integrated IC

operates at 3.3V and converts the photocurrent into LVDS

electrical output.

Package

The transceiver package consists of three basic elements;

two opto-electical subassemblies and the housing as il-

lustrated in the block diagrams in  gure 1. The package

outline drawing and pin-outs are shown in  gures 2 and 7.

Features

 Fast Ethernet communications over POF

 Link lengths up to 50m POF (NA0.5) or 70m POF (NA0.3)

 Compact foot print

 3.3V operation

 Data rates up to 250 MBd

 LVDS Input and Output data connections

 Analog RSSI (receiver signal strength) monitor output

 Temperature range -40°C to 85°C

Applications

 Factory automation at Fast Ethernet speeds

 Fast Ethernet networking over POF

Figure 1. Block diagram

Dierential

Data Output

RSSI Output

Dierential

Data Input

Integrated

Photodiode

LED

Integrated

Receiver

LED

Driver

The opto-electrical subassemblies utilize a high volume assembly process together with low cost lens elements which

result in a cost e ective building block. It consists of the active III-V devices, IC chips and various surface mounted pas-

sive components.

There are eight signal pins, four EMI shield solder posts and two mounting posts, which exit the bottom of the housing.

The solder posts are isolated from the internal circuit of the transceiver and are to be connected to chassis ground. The

mounting posts are to provide mechanical strength to hold the transceiver to the application board.

Pin Description

Pin 1 TData+: Transmitter data in positive. This input is an LVDS compatible di erential line.

Pin 2 TData-: Transmitter data in negative. This input is an LVDS compatible di erential line.

Pin 3 TxVCC: Transmitter power supply pin. Provide +3.3 V DC via a transmitter power supply  lter circuit.

Locate the power supply  lter circuit as close as possible to the TxVcc pin.

Pin 4 GND: Common ground pin. Directly connect this pin to the signal ground plane of the host board.

Pin 5 RxVCC: Receiver power supply pin. Provide +3.3 V DC via a receiver power supply  lter circuit.

Locate the power supply  lter circuit as close as possible to the RxVcc pin.

Pin 6 RSSI: Receiver signal strength pin, delivers a DC output current proportional to the average incoming light power.

Pin 7 RData+: Receiver data out positive. This data line is an LVDS compatible di erential output line which should be

properly terminated. In absence of an optical input signal, this line is squelched.

Pin 8 RData-: Receiver data out negative. This data line is an LVDS compatible di erential output line which should be

properly terminated. In absence of an optical input signal, this line (same as RData+) is squelched.

Shield Shield This is to be connected to the equipment chassis ground.

Figure 2. PCB footprint and pinout diagram

Top View

NOTE S:

1) Dimens ion: mm

2) G eneral tolerance: ±

0.05

3) Recommended PCB Thickness 1.57

± 0.05

4) Pin description

0.63

1.9

3.17

4.44

7.77

0.64

1.91

3.18

4.45

7.77

3.05

6.35

8.89

3.73

3.18

8.66

2.45

5.76

6.7

7.78

2.45

5.76

6.7

7.78

 3.2

0.1+

(2x)

MOUNT POS T

UNPLATED (2x)

STANDOFF

AR E A (4 x 1.9 x 1)

STANDOFF

AR E A (2 x 0.65 x 1.03)

ź Front ź

PIN FUNC

1TD+

2TD-

3TxVcc

4GND

RxVcc

6 RSSI

7RD+

RD-



(

)



(

)

Application Circuit

The recommended application circuitry is shown in  gure 3

Figure 3. Recommended application circuitry

Board Layout – Decoupling Circuit and Ground Planes

It is important to take care of the layout of the application circuitry to achieve optimum performance of the transceiver.

A power supply decoupling circuit is recommended to  lter out noise, to assure optimal product performance. It is fur-

ther recommended that a contiguous signal ground plane be provided in the circuit board directly under the transceiver

to provide a low inductance ground for signal return current. It is also recommended that the shield posts be connected

to the chassis ground to provide optimum EMI, ESD and EMS performance. This recommendation is in keeping with

good high frequency board layout practices.

Regulatory Compliance Table

Feature Test Method Performance

Electrostatic discharge

(ESD) to the electrical Pins

ESD22-A114 Withstands up to 2000V HBM applied between the electrical pins.

Immunity Variation of IEC 61000-4-3 Typically shows no measurable e ect from a 15V/m  eld swept from

8MHz to 1GHz applied to the transceiver when mounted on a circuit

board without chassis enclosure.

Eye Safety EN 60825-1:52007 Laser class 1 product (LED radiation only).

TÜV certi cate: R 50217706.

CAUTION – Use of controls or adjustments of performance or proce-

dures other than those speci ed herein may result in hazardous radia-

tion exposure

Component recognition Underwriter Laboratories UL File #: E173874

VC C 3.3V

1μH

10μF 100nF

100nF

100

C5 C6

C7 C8

TD+

TD-

RD+

RD-

RSSI

LED-Driver

Amplier

and

quantizer

TxVcc

RxVcc

TD+

TD-

RD+

RD-

GND Chasis GND

Control Circuitry

AFBR-5972xZ

100nF

C10

RSSI

100nF

LVDS

P1-P3 P4-P6 P7-P7

AFBR-5972BZ

Mfr. #:

Buy AFBR-5972BZ

Manufacturer:

Broadcom / Avago

Description:

Fiber Optic Transmitters, Receivers, Transceivers 650nm FE Tceiver POF VL Enh blue

Lifecycle:

New from this manufacturer.

Delivery:

DHL FedEx Ups TNT EMS

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AFBR-5972BZ