5
© 2013 Semtech Corporation
www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
RClamp7538P
Assembly Guidelines
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joint. Semtech's recommended assem-
bly guidelines for mounting this device are shown in
the Table. The figure below details Semtech’s recom-
mended aperture based on the below recommenda-
tions. Note that these are only recommendations and
should serve only as a starting point for design since
there are many factors that affect the assembly
process. The exact manufacturing parameters will
require some experimentation to get the desired
solder application.
Recommended Mounting Pattern
Applications Information
Stencil Opening
Land Pad ( Follow Drawing)
All Dimensions are in mm.
Land Pad.
Stencil opening Component
3.800
0.700
1.000
0.250
0.350
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