15
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POWER MANAGEMENT
SC4501
frequency. However it reduces the phase margin. The
values of R
3
and C
4
can be determined empirically by
observing the inductor current and the output voltage
during load transient. Compensation is optimized when
the largest R
3
and the smallest C
4
without producing
ringing or excessive overshoot in its inductor current and
output voltage are found. Figures 10(b), 11(c), 12(b) and
12(c) show load transient responses of empirically
optimized DC-DC converters. In a battery-operated
system, compensating for the minimum V
IN
and the
maximum load step will ensure stable operation over the
entire input voltage range.
C
5
adds a feedforward zero to the loop response. In some
cases it improves the transient speed of the converter. C
6
rolls off the gain at high frequency. This helps to stabilize
the loop. C
5
and C
6
are often not needed.
Board Layout Considerations
In a step-up switching regulator, the output filter capacitor,
the main power switch and the rectifying diode carry
switched currents with high di/dt. For jitter-free operation,
Application Information
the size of the loop formed by these components should
be minimized. Since the power switch is integrated inside
the SC4501, grounding the output filter capacitor next to
the SC4501 ground pin minimizes size of the high di/dt
current loop. The input bypass capacitors should also be
placed close to the input pins. Shortening the trace at the
SW node reduces the parasitic trace inductance. This not
only reduces EMI but also decreases the sizes of the
switching voltage spikes and glitches.
Figure 9 shows how various external components are placed
around the SC4501. The frequency-setting resistor should
be placed near the ROSC pin with a short ground trace
on the PC board. These precautions reduce switching
noise pickup at the ROSC pin.
To achieve a junction to ambient thermal resistance (θ
JA
)
of 40°C/W, the exposed pad of the SC4501 should be
properly soldered to a large ground plane. Use only 12mil
diameter vias in the ground plane if necessary. Avoid using
larger vias under the device. Molten solder may seep
through large vias during reflow, resulting in poor adhesion,
poor thermal conductivity and low reliability.
Typical Application Circuits
Upper Trace : Output Voltage, AC Coupled, 1V/div
Lower Trace : Inductor Current, 0.5A/div
40μs/div
Figure 10(b). Load Transient Response of the Circuit in Figure
10(a). I
LOAD
is switched between 0.1A and 0.4A at
1A/μs.
C1
2.2μF
3.3V
VIN
VOUT
SC4501
2
3
1
5
6
4
GND
SHDN
SS
IN SW
FB
ROSC
COMP
8
7
ONOFF
C3
C4
10BQ015
C2
R2
R1
R3
R4
D1
L1
3.3μH
10μF
47nF
1.5nF
20K
22.1K
174K
12V, 0.4A
9.31K
Figure 10(a). 1.35 MHz All Ceramic Capacitor 3.3V to 12V Boost
L1: Cooper-Bussmann SD25-3R3
Converter. Pinout Shown is for MSOP-8