SpecNo.JELF243A-0097D-01 P3/9
MURATA MFG.CO., LTD
Reference Only
7. Mechanical Performance
No. Item Specification Test Method
7.1 Shear Test Chip coil shall not be damaged.
Substrate:Glass-epoxy substrate
Applied Direction:
Force:10N
Hold Duration:5±1s
7.2
Bending Test Chip coil shall not be damaged.
Substrate:Glass-epoxy substrate
(100×40×1.0mm)
Speed of Applying Force:0.5mm / s
Deflection:2mm
Hold Duration:5seconds.
(in mm)
7.3
Vibration Chip coil shall not be damaged.
Oscillation Frequency:10~2000~10Hz for 20minutes
Total Amplitude:1.5mm or Acceleration amplitude
196m/s
2
whichever is smaller.
Testing Time:A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 hours)
7.4
Solderability shall be at least 90% covered with
new solder coating.The wetting area
of the electrode
Flux:Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150±10°C / 60 to 90seconds
Solder Temperature:240±5°C
Immersion Time:3±1 s
7.5
Resistance to
Soldering
Heat
Appearance:No damage
Inductance Change:within ±10%
Flux:Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150±10°C / 60 to 90seconds
Solder Temperature:270±5°C
Immersion Time:10±1 s
Then measured after exposure in the room condition for
24±2 hours.
F
Chip coil
Substrate
45
R230
F
Deflection
45
Product
Pressure jig