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NLV17SZ125DFT1G
P1-P3
P4-P6
P7-P9
P10-P12
NL17SZ125
www
.onsemi.com
7
DEVICE ORDERING INFORMA
TION
Device
Package
Shipping
†
NL17SZ125DFT2G
SC−88A (SOT−353)
(Pb−Free)
3000 /
T
ape
& Reel
NL
V17SZ125DFT1G*
SC−88A (SOT−353)
(Pb−Free)
3000 /
T
ape
& Reel
NL
V17SZ125DFT2G*
SC−88A (SOT−353)
(Pb−Free)
3000 /
T
ape
& Reel
NL17SZ125XV5T2G
SOT−553
(Pb−Free)
4000 /
T
ape
& Reel
NL17SZ125DTT1G
TSOP−5
(Pb−Free)
3000 / T
ape & Reel
NL17SZ125CMUTCG
UDFN6, 1.0 x 1.0 x 0.35P
(Pb−Free)
3000 / T
ape & Reel
NL17SZ125P5T5G
SOT−953
(Pb−Free)
8000 / T
ape & Reel
†
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our T
ape and Reel
Packaging
Specifications Brochure, BRD801
1/D.
*NL
V Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PP
A
P
Capable.
NL17SZ125
www
.onsemi.com
8
P
ACKAGE DIMENSIONS
NOTES:
1.
DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2.
CONTROLLING DIMENSION: INCH.
3.
419A−01 OBSOLETE. NEW ST
ANDARD
419A−02.
4.
DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GA
TE
BURRS.
DIM
A
MIN
MAX
MIN
MAX
MILLIMETERS
1.80
2.20
0.071
0.087
INCHES
B
1.15
1.35
0.045
0.053
C
0.80
1.10
0.031
0.043
D
0.10
0.30
0.004
0.012
G
0.65 BSC
0.026 BSC
H
---
0.10
---
0.004
J
0.10
0.25
0.004
0.010
K
0.10
0.30
0.004
0.012
N
0.20 REF
0.008 REF
S
2.00
2.20
0.079
0.087
B
0.2 (0.008)
MM
12
3
4
5
A
G
S
D
5 PL
H
C
N
J
K
−B−
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
ǒ
mm
inches
Ǔ
SCALE 20:1
0.65
0.025
0.65
0.025
0.50
0.0197
0.40
0.0157
1.9
0.0748
SOLDER FOOTPRINT*
*For
additional information on our Pb−Free strategy and soldering
details, please download the
ON Semiconductor Soldering and
Mounting T
echniques Reference Manual, SOLDERRM/D.
NL17SZ125
www
.onsemi.com
9
P
ACKAGE DIMENSIONS
SOT−553, 5 LEAD
CASE 463B
ISSUE C
1.35
0.0531
0.5
0.0197
ǒ
mm
inches
Ǔ
SCALE 20:1
0.5
0.0197
1.0
0.0394
0.45
0.0177
0.3
0.01
18
*For
additional information on our Pb−Free strategy and soldering
details, please download the
ON Semiconductor Soldering and
Mounting T
echniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
e
M
0.08 (0.003)
X
b
5 PL
A
c
−X−
−Y−
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2.
CONTROLLING DIMENSION: MILLIMETERS
3.
MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MA
TERIAL.
D
E
Y
12
3
4
5
L
H
E
DIM
A
MIN
NOM
MAX
MIN
MILLIMETERS
0.50
0.55
0.60
0.020
INCHES
b
0.17
0.22
0.27
0.007
c
D
1.55
1.60
1.65
0.061
E
1.15
1.20
1.25
0.045
e
0.50 BSC
L
0.10
0.20
0.30
0.004
0.022
0.024
0.009
0.01
1
0.063
0.065
0.047
0.049
0.008
0.012
NOM
MAX
1.55
1.60
1.65
0.061
0.063
0.065
H
E
0.08
0.13
0.18
0.003
0.005
0.007
0.020 BSC
P1-P3
P4-P6
P7-P9
P10-P12
NLV17SZ125DFT1G
Mfr. #:
Buy NLV17SZ125DFT1G
Manufacturer:
ON Semiconductor
Description:
Buffers & Line Drivers SINGLE NON INVERTING BUFFER
Lifecycle:
New from this manufacturer.
Delivery:
DHL
FedEx
Ups
TNT
EMS
Payment:
T/T
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