NL17SZ125
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3
MAXIMUM RATINGS
Symbol Parameter Value Units
V
CC
DC Supply Voltage −0.5 to +7.0 V
V
IN
DC Input Voltage −0.5 to +7.0 V
V
OUT
DC Output Voltage
(SOT−353/TSOP−5/SC−88A/SOT−553/UDFN Packages) Power−Down Mode
−0.5 to +7.0 V
V
OUT
DC Output Voltage
(SOT−953 Package)
−0.5 to V
CC
+0.5 V
I
IK
DC Input Diode Current −50 mA
I
OK
DC Output Diode Current V
OUT
< GND, V
OUT
> V
CC
(SOT−953 Package)
±50 mA
I
OK
DC Output Diode Current V
OUT
< GND
(SOT−353/SC70−5/SC−88A/SOT−553 Packages)
−50 mA
I
OUT
DC Output Sink Current ±50 mA
I
CC
DC Supply Current per Supply Pin ±100 mA
T
STG
Storage Temperature Range −65 to +150 °C
T
L
Lead Temperature, 1 mm from Case for 10 Seconds 260 °C
T
J
Junction Temperature Under Bias +150 °C
q
JA
Thermal Resistance (Note 1)
SC−88A/SOT−553
TSOP−5
350
230
°C/W
P
D
Power Dissipation in Still Air at 85°C 150 mW
MSL Moisture Sensitivity Level 1
F
R
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
V
ESD
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
u2000
u200
N/A
V
I
LATCHUP
Latchup Performance Above V
CC
and Below GND at 125°C (Note 5) ±100 mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
