STTH108 Characteristics
Doc ID 9342 Rev 3 3/6
Figure 1. Conduction losses versus average
current
Figure 2. Forward voltage drop versus
forward current
P(W)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
I (A)
F(AV)
T
δ
=tp/T
tp
δ = 1
δ = 0.05
δ = 0.5
δ = 0.2
δ = 0.1
0.1
1.0
10.0
100.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
I (A)
FM
V (V)
FM
T =25°C
(maximum values)
j
T =150°C
(maximum values)
j
T =150°C
(typical values)
j
Figure 3. Relative variation of thermal
impedance junction ambient versus
pulse duration (DO-41)
Figure 4. Relative variation of thermal
impedance junction ambient versus
pulse duration (epoxy FR4) (SMA)
Z/R
th(j-c) th(j-c)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
t (s)
p
T
δ
=tp/T
tp
δ = 0.5
δ = 0.2
δ = 0.1
Single pulse
epoxy FR4, leads = 10 mm
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z/R
th(j-c) th(j-c)
t (s)
p
T
δ
=tp/T
tp
δ = 0.5
δ = 0.2
δ = 0.1
Single pulse
Figure 5. Thermal resistance junction to
ambient versus copper surface
under each lead (DO-41)
Figure 6. Thermal resistance junction to
ambient versus copper surface
under each lead (SMA)
R (°C/W)
th(j-a)
0
10
20
30
40
50
60
70
80
90
100
110
120
012345678910
S(cm²)
epoxy printed circuit board FR4, copper thickness: 35 µm
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
S(cm²)
epoxy printed circuit board FR4, copper thickness: 35 µm