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MC74HC373ADT

P1-P3P4-P6P7-P7
© Semiconductor Components Industries, LLC, 2014
August, 2014 − Rev. 15
1 Publication Order Number:
MC74HC373A/D
MC74HC373A
Octal 3-State Non-Inverting
Transparent Latch
High−Performance Silicon−Gate CMOS
The MC74HC373A is identical in pinout to the LS373. The device
inputs are compatible with standard CMOS outputs; with pullup
resistors, they are compatible with LSTTL outputs.
These latches appear transparent to data (i.e., the outputs change
asynchronously) when Latch Enable is high. When Latch Enable goes
low, data meeting the setup and hold time becomes latched.
The Output Enable input does not affect the state of the latches, but
when Output Enable is high, all device outputs are forced to the
high−impedance state. Thus, data may be latched even when the
outputs are not enabled.
The HC373A is identical in function to the HC573A which has the
data inputs on the opposite side of the package from the outputs to
facilitate PC board layout.
The HC373A is the non−inverting version of the HC533A.
Features
• Output Drive Capability: 15 LSTTL Loads
• Outputs Directly Interface to CMOS, NMOS and TTL
• Operating Voltage Range: 2.0 to 6.0 V
• Low Input Current: 1.0 mA
• High Noise Immunity Characteristic of CMOS Devices
• In Compliance with the JEDEC Standard No. 7.0 A Requirements
• Chip Complexity: 186 FETs or 46.5 Equivalent Gates
• These Devices are Pb−Free and are RoHS Compliant
DATA
INPUTS
D0
D1
D2
D3
D4
D5
D6
D7
18
17
14
13
8
7
4
3
1
OUTPUT ENABLE
19
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
16
15
12
9
6
5
2
PIN 20 = V
CC
PIN 10 = GND
NONINVERTING
OUTPUTS
11
LATCH ENABLE
LOGIC DIAGRAM
http://onsemi.com
MARKING DIAGRAMS
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
1
20
SOIC−20
HC373A
AWLYYWWG
HC
373A
ALYWG
G
TSSOP−20
20
1
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G or G = Pb−Free Package
(Note: Microdot may be in either location)
SOIC−20
DW SUFFIX
CASE 751D
TSSOP−20
DT SUFFIX
CASE 948E
FUNCTION TABLE
Inputs Output
Output Latch
Enable Enable D Q
LHH H
LHL L
L L X No Change
HXX Z
X = Don’t Care
Z = High Impedance
PIN ASSIGNMENT
Q2
D1
D0
Q0
OUTPUT
ENABLE
GND
Q3
D3
D2
Q1
5
4
3
2
1
10
9
8
7
6
14
15
16
17
18
19
20
11
12
13
Q6
D6
D7
Q7
V
CC
LATCH
ENABLE
Q4
D4
D5
Q5
MC74HC373A
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2
Design Criteria Value Units
Internal Gate Count* 46.5 ea
Internal Gate Propagation Delay 1.5 ns
Internal Gate Power Dissipation 5.0
mW
Speed Power Product 0.0075 pJ
*Equivalent to a two−input NAND gate.
MAXIMUM RATINGS
Symbol Parameter Value Unit
V
CC
DC Supply Voltage (Referenced to GND) –0.5 to +7.0 V
V
in
DC Input Voltage (Referenced to GND) –0.5 to V
CC
+ 0.5 V
V
out
DC Output Voltage (Referenced to GND) –0.5 to V
CC
+ 0.5 V
I
in
DC Input Current, per Pin ±20 mA
I
out
DC Output Current, per Pin ±35 mA
I
CC
DC Supply Current, V
CC
and GND Pins ±75 mA
P
D
Power Dissipation in Still Air, SOIC Package†
TSSOP Package†
500
450
mW
T
stg
Storage Temperature –65 to +150
_C
T
L
Lead Temperature, 1 mm from Case for 10 Seconds
(SOIC, SSOP or TSSOP Package)
260
_C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of
these limits are exceeded, device functionality should not be assumed, damage may occur and
reliability may be affected.
†Derating: SOIC Package: –7 mW/_C from 65_ to 125_C
TSSOP Package: −6.1 mW/_C from 65_ to 125_C
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
V
CC
DC Supply Voltage (Referenced to GND) 2.0 6.0 V
V
in
, V
out
DC Input Voltage, Output Voltage (Referenced to GND) 0 V
CC
V
T
A
Operating Temperature, All Package Types –55 +125
_C
t
r
, t
f
Input Rise and Fall Time V
CC
= 2.0 V
(Figure 1) V
CC
= 4.5 V
V
CC
= 6.0 V
0
0
0
1000
500
400
ns
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance cir-
cuit. For proper operation, V
in
and
V
out
should be constrained to the
range GND v (V
in
or V
out
) v V
CC
.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or V
CC
).
Unused outputs must be left open.
MC74HC373A
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3
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol Parameter Test Conditions
V
CC
V
–55 to 25_C v 85_C v 125_C
Unit
V
IH
Minimum High−Level Input
Voltage
V
out
= V
CC
– 0.1 V
|I
out
| v 20 mA
2.0
3.0
4.5
6.0
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
V
V
IL
Maximum Low−Level Input
Voltage
V
out
= 0.1 V
|I
out
| v 20 mA
2.0
3.0
4.5
6.0
0.5
0.9
1.35
1.8
0.5
0.9
1.35
1.8
0.5
0.9
1.35
1.8
V
V
OH
Minimum High−Level Output
Voltage
V
in
= V
IH
|I
out
| v 20 mA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
V
in
= V
IH
|I
out
| v 2.4 mA
|I
out
| v 6.0 mA
|I
out
| v 7.8 mA
3.0
4.5
6.0
2.48
3.98
5.48
2.34
3.84
5.34
2.2
3.7
5.2
V
OL
Maximum Low−Level Output
Voltage
V
in
= V
IL
|I
out
| v 20 mA
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
V
in
= V
IL
|I
out
| v 2.4 mA
|I
out
| v 6.0 mA
|I
out
| v 7.8 mA
3.0
4.5
6.0
0.26
0.26
0.26
0.33
0.33
0.33
0.4
0.4
0.4
I
in
Maximum Input Leakage Current V
in
= V
CC
or GND 6.0 ±0.1 ±1.0 ±1.0
mA
I
OZ
Maximum Three−State
Leakage Current
Output in High−Impedance State
V
in
= V
IL
or V
IH
V
out
= V
CC
or GND
6.0 ±0.5 ±5.0 ±10
mA
I
CC
Maximum Quiescent Supply
Current (per Package)
V
in
= V
CC
or GND
I
out
= 0 mA
6.0 4.0 40 160
mA
AC ELECTRICAL CHARACTERISTICS (C
L
= 50 pF, Input t
r
= t
f
= 6.0 ns)
Symbo
l
Parameter
V
CC
V
Guaranteed Limit
Unit
–55 to 25_C v 85_C v 125_C
t
PLH
t
PHL
Maximum Propagation Delay, Input D to Q
(Figures 1 and 5)
2.0
3.0
4.5
6.0
125
80
25
21
155
110
31
26
190
130
38
32
ns
t
PLH
t
PHL
Maximum Propagation Delay, Latch Enable to Q
(Figures 2 and 5)
2.0
3.0
4.5
6.0
140
90
28
24
175
120
35
30
210
140
42
36
ns
t
PLZ
t
PHZ
Maximum Propagation Delay, Output Enable to Q
(Figures 3 and 6)
2.0
3.0
4.5
6.0
150
100
30
26
190
125
38
33
225
150
45
38
ns
t
PZL
t
PZH
Maximum Propagation Delay, Output Enable to Q
(Figures 3 and 6)
2.0
3.0
4.5
6.0
150
100
30
26
190
125
38
33
225
150
45
38
ns
t
TLH
t
THL
Maximum Output Transition Time, Any Output
(Figures 1 and 5)
2.0
3.0
4.5
6.0
60
23
12
10
75
27
15
13
90
32
18
15
ns
C
in
Maximum Input Capacitance 10 10 10 pF
C
out
Maximum Three−State Output Capacitance
(Output in High−Impedance State)
15 15 15 pF
C
PD
Power Dissipation Capacitance (Per Enabled Output)*
Typical @ 25°C, V
CC
= 5.0 V
pF
36
* Used to determine the no−load dynamic power consumption: P
D
= C
PD
V
CC
2
f + I
CC
V
CC
.
P1-P3P4-P6P7-P7

MC74HC373ADT

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Manufacturer:
ON Semiconductor
Description:
IC LATCH TRANSP OCT 3ST 20-TSSOP
Lifecycle:
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