ADG758/ADG759
Rev. B | Page 12
OUTLINE DIMENSIONS
20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-20-6)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADG758BCPZ –40°C to +85°C 20-Lead Lead Frame Chip Scale Package (LFCSP_WQ) CP-20-6
ADG758BCPZ-REEL7 –40°C to +85°C 20-Lead Lead Frame Chip Scale Package (LFCSP_WQ) CP-20-6
ADG759BCPZ –40°C to +85°C 20-Lead Lead Frame Chip Scale Package (LFCSP_WQ) CP-20-6
ADG759BCPZ-REEL –40°C to +85°C 20-Lead Lead Frame Chip Scale Package (LFCSP_WQ) CP-20-6
ADG759BCPZ-REEL7 –40°C to +85°C 20-Lead Lead Frame Chip Scale Package (LFCSP_WQ) CP-20-6
1
Z = RoHS Compliant Part.
REVISION HISTORY
3/13—Rev. A to Rev. B
Updated Outline Dimensions ........................................................ 12
Changes to Ordering Guide ........................................................... 12
5/02—Rev. 0 to Rev. A
Edits to General Description section .............................................. 1
Updated Outline Drawings ............................................................ 12
0.50
BSC
0.65
0.60
0.55
0.30
0.25
0.18
COMPLIANT
TO
JEDEC STANDARDS MO-220-WGGD-1.
BOTTOM VIEWTOP VIEW
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
4.10
4.00 SQ
3.90
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
2.30
2.10 SQ
2.00
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATIONS
SECTION OF THIS DATA SHEET.
1
20
6
10
11
15
16
5
08-16-2010-B
©2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D02371-0-3/13(B)