NCP2820 Series
http://onsemi.com
21
PACKAGE DIMENSIONS
8 PIN UDFN, 2x2.2, 0.5P
CASE 506AV
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A B
E
D
D2
E2
BOTTOM VIEW
b
e
8X
0.10 B
0.05
AC
C
K8X
NOTE 3
2X
0.10 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.10 C
8X
A
A1
(A3)
0.08 C
0.10 C
C
SEATING
PLANE
SIDE VIEW
L
8X
1
4
58
DIM MIN NOM MAX
MILLIMETERS
A 0.45 0.50 0.55
A1 0.00 0.03 0.05
A3 0.127 REF
b 0.20 0.25 0.30
D 2.00 BSC
D2 1.40 1.50 1.60
E 2.20 BSC
E2 0.70 0.80 0.90
e 0.50 BSC
K 0.20 −−− −−−
L 0.35 0.40 0.45
8X
0.48
1.60
0.80
1
0.25
0.50
PITCH
2.15
8X
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
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