1. Product profile
1.1 General description
NPN silicon planar epitaxial transistor in a 4-pin dual-emitter SOT143R plastic package.
1.2 Features and benefits
High power gain
Low noise figure
High transition frequency
Gold metallization ensures excellent reliability
1.3 Applications
Intended for Radio Frequency (RF) front end applications in the GHz range, such as:
analog and digital cellular telephones
cordless telephones (Cordless Telephone (CT), Personal Communication
Network (PCN), Digital Enhanced Cordless Telecommunications (DECT), etc.)
radar detectors
pagers
Satellite Antenna TeleVision (SATV) tuners
repeater amplifiers in fiber-optic systems
1.4 Quick reference data
BFG325/XR
NPN 14 GHz wideband transistor
Rev. 2 — 15 September 2011 Product data sheet
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
V
CBO
collector-base voltage open emitter - - 15 V
V
CEO
collector-emitter voltage open base - - 6 V
I
C
collector current (DC) - - 35 mA
P
tot
total power dissipation T
sp
90 C
[1]
- - 210 mW
h
FE
DC current gain I
C
=15mA; V
CE
=3V;
T
j
=25C
60 100 200
C
CBS
collector-base
capacitance
V
CB
= 5 V; f = 1 MHz;
emitter grounded
- 0.26 0.4 pF
f
T
transition frequency I
C
=15mA; V
CE
=3V;
f=1GHz; T
amb
=25C
-14-GHz
BFG325_XR All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 15 September 2011 2 of 13
NXP Semiconductors
BFG325/XR
NPN 14 GHz wideband transistor
[1] T
sp
is the temperature at the soldering point of the collector pin.
[2] G
max
is the maximum power gain, if K > 1. If K < 1 then G
max
= MSG, see Figure 4.
2. Pinning information
3. Ordering information
4. Marking
[1] * = p: made in Hong Kong.
G
max
maximum power gain
[2]
I
C
=15mA; V
CE
=3V;
f=1.8GHz; T
amb
=25C
- 18.3 - dB
s
21
2
insertion power gain I
C
=15mA; V
CE
=3V;
f=1.8GHz; T
amb
=25C;
Z
S
=Z
L
=50
-14-dB
NF noise figure
s
=
opt
; I
C
=3mA;
V
CE
=3V; f=2GHz
-1.1-dB
Table 1. Quick reference data …continued
Symbol Parameter Conditions Min Typ Max Unit
Table 2. Pinning
Pin Description Simplified outline Symbol
1 collector
2emitter
3base
4emitter
21
43
sym086
1
2, 4
3
Table 3. Ordering information
Type number Package
Name Description Version
BFG325/XR SC-61AA plastic surface mounted package; reverse pinning;
4 leads
SOT143R
Table 4. Marking codes
Type number Marking code
[1]
BFG325/XR S2*
BFG325_XR All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 15 September 2011 3 of 13
NXP Semiconductors
BFG325/XR
NPN 14 GHz wideband transistor
5. Limiting values
[1] T
sp
is the temperature at the soldering point of the collector pin.
6. Thermal characteristics
[1] T
sp
is the temperature at the soldering point of the collector pin.
7. Characteristics
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
CBO
collector-base voltage open emitter - 15 V
V
CEO
collector-emitter voltage open base - 6 V
V
EBO
emitter-base voltage open collector - 2 V
I
C
collector current (DC) - 35 mA
P
tot
total power dissipation T
sp
90 C
[1]
- 210 mW
T
stg
storage temperature 65 +175 C
T
j
junction temperature - 175 C
Table 6. Thermal characteristics
Symbol Parameter Conditions Typ Unit
R
th(j-sp)
thermal resistance from junction to solder point T
sp
90 C
[1]
405 K/W
Table 7. Characteristics
T
j
=25
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
I
CBO
collector-base cut-off current I
E
=0A; V
CB
=5V - - 15 nA
h
FE
DC current gain I
C
=15mA; V
CE
= 3 V 60 100 200
C
CBS
collector-base capacitance V
CB
= 5 V; f = 1 MHz; emitter grounded - 0.26 0.4 pF
C
CES
collector-emitter capacitance V
CE
= 5 V; f = 1 MHz; base grounded - 0.27 - pF
C
EBS
emitter-base capacitance V
EB
= 0.5 V; f = 1 MHz; collector grounded - 0.53 - pF
f
T
transition frequency I
C
=15mA; V
CE
=3V; f=1GHz;
T
amb
=25C
-14-GHz
G
max
maximum power gain
[1]
I
C
=15mA; V
CE
=3V; f=1.8GHz;
T
amb
=25C
- 18.3 - dB
s
21
2
insertion power gain I
C
=15mA; V
CE
=3V; T
amb
=25C;
Z
S
=Z
L
=50
f = 1.8 GHz - 14 - dB
f=3GHz - 10 - dB
NF noise figure
s
=
opt
; I
C
=3mA; V
CE
=3V; f=2GHz - 1.1 - dB
P
L(1dB)
output power at 1 dB gain
compression
I
C
= 15 mA; V
CE
=3V; f=1.8GHz;
T
amb
=25C; Z
S
=Z
L
=50
-8.7-dBm
IP3 third order intercept point I
C
=15mA; V
CE
=3V; f=1.8GHz;
T
amb
=25C; Z
S
=Z
L
=50
- 19.4 - dBm

BFG325/XR,215

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
RF TRANS NPN 6V 14GHZ SOT143R
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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