NVMFS5C612NLWFT1G

© Semiconductor Components Industries, LLC, 2016
February, 2017 Rev. 6
1 Publication Order Number:
NVMFS5C612NL/D
NVMFS5C612NL
Power MOSFET
60 V, 1.36 mW, 250 A, Single NChannel
Features
Small Footprint (5x6 mm) for Compact Design
Low R
DS(on)
to Minimize Conduction Losses
Low Q
G
and Capacitance to Minimize Driver Losses
NVMFS5C612NLWF Wettable Flank Option for Enhanced Optical
Inspection
AECQ101 Qualified and PPAP Capable
These Devices are PbFree and are RoHS Compliant
MAXIMUM RATINGS (T
J
= 25°C unless otherwise noted)
Parameter
Symbol Value Unit
DraintoSource Voltage V
DSS
60 V
GatetoSource Voltage V
GS
±20 V
Continuous Drain
Current R
q
JC
(Notes 1, 3)
Steady
State
T
C
= 25°C
I
D
250
A
T
C
= 100°C 175
Power Dissipation
R
q
JC
(Note 1)
T
C
= 25°C
P
D
167
W
T
C
= 100°C 83
Continuous Drain
Current R
q
JA
(Notes 1, 2, 3)
Steady
State
T
A
= 25°C
I
D
38
A
T
A
= 100°C 27
Power Dissipation
R
q
JA
(Notes 1 & 2)
T
A
= 25°C
P
D
3.8
W
T
A
= 100°C 1.9
Pulsed Drain Current
T
A
= 25°C, t
p
= 10 ms
I
DM
900 A
Operating Junction and Storage Temperature T
J
, T
stg
55 to
+175
°C
Source Current (Body Diode) I
S
164 A
Single Pulse DraintoSource Avalanche
Energy (I
L(pk)
= 17 A)
E
AS
451 mJ
Lead Temperature for Soldering Purposes
(1/8 from case for 10 s)
T
L
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter Symbol Value Unit
JunctiontoCase Steady State
R
q
JC
0.9
°C/W
JunctiontoAmbient Steady State (Note 2)
R
q
JA
39
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Surfacemounted on FR4 board using a 650 mm
2
, 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
MARKING
DIAGRAM
www.onsemi.com
XXXXXX
AYWZZ
V
(BR)DSS
R
DS(ON)
MAX I
D
MAX
60 V
1.36 mW @ 10 V
250 A
2.3 mW @ 4.5 V
G (4)
S (1,2,3)
NCHANNEL MOSFET
D (5,6)
S
S
S
G
D
D
D
D
DFN5
(SO8FL)
CASE 488AA
STYLE 1
1
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
XXXXXX = 5C612L
XXXXXX = (NVMFS5C612NL) or
XXXXXX = 612LWF
XXXXXX = (NVMFS5C612NLWF)
A = Assembly Location
Y = Year
W = Work Week
ZZ = Lot Traceability
NVMFS5C612NL
www.onsemi.com
2
ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise specified)
Parameter
Symbol Test Condition Min Typ Max Unit
OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
V
(BR)DSS
V
GS
= 0 V, I
D
= 250 mA
60 V
DraintoSource Breakdown Voltage
Temperature Coefficient
V
(BR)DSS
/
T
J
12.7
mV/°C
Zero Gate Voltage Drain Current I
DSS
V
GS
= 0 V,
V
DS
= 60 V
T
J
= 25 °C 10
mA
T
J
= 125°C 250
GatetoSource Leakage Current I
GSS
V
DS
= 0 V, V
GS
= ±16 V ±100 nA
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
V
GS(TH)
V
GS
= V
DS
, I
D
= 250 mA
1.2 2.0 V
Threshold Temperature Coefficient V
GS(TH)
/T
J
5.76 mV/°C
DraintoSource On Resistance R
DS(on)
V
GS
= 10 V I
D
= 50 A 1.13 1.36
mW
V
GS
= 4.5 V I
D
= 50 A 1.65 2.3
Forward Transconductance g
FS
V
DS
= 15 V, I
D
= 50 A 151 S
CHARGES, CAPACITANCES & GATE RESISTANCE
Input Capacitance
C
ISS
V
GS
= 0 V, f = 1 MHz, V
DS
= 25 V
6660
pF
Output Capacitance C
OSS
2953
Reverse Transfer Capacitance C
RSS
45
Total Gate Charge Q
G(TOT)
V
GS
= 4.5 V, V
DS
= 30 V; I
D
= 50 A 41
nC
Total Gate Charge Q
G(TOT)
V
GS
= 10 V, V
DS
= 30 V; I
D
= 50 A 91
Threshold Gate Charge Q
G(TH)
V
GS
= 4.5 V, V
DS
= 30 V; I
D
= 50 A
5
GatetoSource Charge Q
GS
17.1
GatetoDrain Charge Q
GD
10.9
Plateau Voltage V
GP
2.9 V
SWITCHING CHARACTERISTICS (Note 5)
TurnOn Delay Time
t
d(ON)
V
GS
= 4.5 V, V
DS
= 30 V,
I
D
= 50 A, R
G
= 1.0 W
19
ns
Rise Time t
r
51
TurnOff Delay Time t
d(OFF)
47
Fall Time t
f
18
DRAINSOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
V
SD
V
GS
= 0 V,
I
S
= 50 A
T
J
= 25°C 0.78 1.2
V
T
J
= 125°C 0.66
Reverse Recovery Time t
RR
V
GS
= 0 V, dIS/dt = 100 A/ms,
I
S
= 50 A
78
ns
Charge Time t
a
36
Discharge Time t
b
42
Reverse Recovery Charge Q
RR
105 nC
4. Pulse Test: pulse width v 300 ms, duty cycle v 2%.
5. Switching characteristics are independent of operating junction temperatures.
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
NVMFS5C612NL
www.onsemi.com
3
TYPICAL CHARACTERISTICS
Figure 1. OnRegion Characteristics Figure 2. Transfer Characteristics
V
DS
, DRAINTOSOURCE VOLTAGE (V) V
GS
, GATETOSOURCE VOLTAGE (V)
3.02.52.01.51.00.50
0
20
40
60
80
100
120
140
4.03.02.52.01.51.00.50
0
20
40
60
80
100
120
200
Figure 3. OnResistance vs. GatetoSource
Voltage
Figure 4. OnResistance vs. Drain Current and
Gate Voltage
V
GS
, GATE VOLTAGE (V) I
D
, DRAIN CURRENT (A)
109.08.07.06.05.04.0
1.1
1.2
1.4
1.6
1.8
2.0
130110 1909070503010
0.5
0.7
1.3
1.5
1.9
Figure 5. OnResistance Variation with
Temperature
Figure 6. DraintoSource Leakage Current
vs. Voltage
T
J
, JUNCTION TEMPERATURE (°C) V
DS
, DRAINTOSOURCE VOLTAGE (V)
150125100752502550
0.7
0.9
1.1
1.3
1.5
1.7
1.9
55453525155
10
100
1000
10,000
1,000,000
I
D
, DRAIN CURRENT (A)
I
D
, DRAIN CURRENT (A)
R
DS(on)
, DRAINTOSOURCE RESISTANCE (mW)
R
DS(on)
, DRAINTOSOURCE RESISTANCE (mW)
R
DS(on)
, NORMALIZED DRAINTO
SOURCE RESISTANCE
I
DSS
, LEAKAGE (nA)
2.8 V
3.0 V
3.2 V
V
GS
= 10 V to 3.4 V
3.5
V
DS
10 V
T
J
= 125°C
T
J
= 25°C
T
J
= 55°C
T
J
= 25°C
I
D
= 50 A
T
J
= 25°C
V
GS
= 4.5 V
V
GS
= 10 V
V
GS
= 10 V
I
D
= 40 A
50 175
T
J
= 125°C
T
J
= 85°C
160
180
200
140
160
180
1.3
1.5
1.7
1.9
2.1
9.58.57.56.55.54.53.5 150 170
0.9
1.1
1.7
0.6
0.8
1.4
1.6
2.0
1.0
1.2
1.8
T
J
= 150°C
100,000

NVMFS5C612NLWFT1G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET NFET SO8FL 60V 235A 1.5MO
Lifecycle:
New from this manufacturer.
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