NCP1622
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16
ZCD
CS/ZCD pin
R
cs1
R
cs2
C
cs
DRV
DRV
OCP
BLANKING
OVERSTRESS
OCP
VSNS
DRAIN
SOURCE
V
OCP,REF
Vcs
int
V
OVS,REF
DRV
OVS
BLANKING
Vcc
CSZCD
BUFFER
DRV
DEMAG
& LINE SENSE
OVERSTRESS
TIMER
Figure 12. Current Sense, Zero Current Detection Blocks and Vin Sense
Current sense, zero current detection and Vin sense are
using the CS/ZCD pin voltage as depicted in the electrical
schematic of Figure 12.
Current Sense
The power MOSFET current I is sensed during the T
ON
phase by the resistor R
sense
inserted between the MOSFET
source and ground (see Figure 13). During T
ON
phase R
cs1
and R
cs2
are almost in parallel and the signal R
sense
.I is equal
to the voltage on pin CS.
I
R
cs1
R
cs2
C
cs
R
sense
D
S
CS
R
dson
R
cs1
R
cs2
C
cs
R
sense
D,S
CS
I
Figure 13. Current Sensing during the T
ON
Phase
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17
During the On−time and after a 200 ns blanking time, an
OCP (Over Current Protection) signal is generated by an
OCP comparator, comparing (V
CS
= V
CS2
) to a 500 mV
internal reference.
When R
sense
I
ds_max
= V
CS
= V
CS2
= 500 mV we get:
I
ds_max
+
V
ocp
R
sense
(eq. 4)
When V
CS
exceeds the 500 mV internal reference
threshold, the OCP signal turns high to reset the PWM latch
and forces the driver low. The 200 ns blanking time prevents
the OCP comparator from tripping because of the switching
spikes that occur when the MOSFET turns on.
Zero Current Detection
The CS pin is also designed to receive, during t
DEMAG
and
t
DT
, a scaled down (divided by 138) power MOSFET drain
voltage that will be used for Zero Current Detection. It may
happen that the MOSFET turns on while a huge current
flows through the inductor. As an example such a situation
can occur at start−up when large in−rush currents charge the
bulk capacitor to the line peak voltage. Traditionally, a
bypass diode is generally placed between the input and
output high−voltage rails to divert this inrush current. If this
diode is accidently shorted, the demagnetization will be
impossible and cycle after cycle the inductor current will
increase so the MOSFET will also see a high current when
it turns on. In both cases, the current can be large enough to
trigger the OverStress (OVS) comparator. In this case, the
“OverStress” signal goes high and disables the driver for an
800 ms delay. This long delay leads to a very low duty−ratio
operation in case of “OverStress” fault in order to limit the
risk of overheating.
When no signal is received that triggers the ZCD
comparator to indicate the end of inductor demagnetization,
an internal 200 ms watchdog timer initiates the next drive
pulse. At the end of this delay, the circuit senses the CS/ZCD
pin impedance to detect a possible grounding of this pin and
prevent operation.
Brown−Out Detection (Versions [C**] and [D**])
For an application w/o Vaux (using the Drain) and using
Brown−out options ([C**] and [D**]) the Brown−out
feature will use the High and Low Brown−out levels.
Brown−out options ([C**] and [D**]) must not be used
on an application using Vaux as these options are not
designed to work in this case.
By default, the Brown−out flag is set High (BONOK=1),
meaning that V
in
,sensed thru CSZCD pin and V
sns
(V
sns
is
a low−pass filtered scaled down V
in
) internal signal (see
Figure 1), when higher than internal reference voltage
V
BOH
will set the brown−out flag to zero (BONOK=0) and
allow the controller to start. After BONOK is set to zero, and
switching activity starts, the V
in
continues to be sensed thru
CSZCD pin and when V
sns
falls under Brown−out internal
reference voltage V
BOL
for 50 ms, BONOK flag will be set
to 1. After BONOK flag will be set to 1, drive is not disabled,
instead, a 30 mA current source is applied to VCTRL pin to
gradually reduce V
ctrl
. As a result, the circuit only stops
pulsing when the STATICOVP function is activated (that is
when V
ctrl
reaches the SKIP detection threshold). At that
moment, the circuit stops switching. This method limits any
risk of false triggering.
For an application w/Vaux (not using the Drain),
Brown−out options ([C**] and [D**]) are not be allowed
and the UVP will act like a brown−in. The reason is that
before controller starts switching, the V
out
voltage is equal
to V
mains,rms
and sensed by FB pin and compared to UVP
high internal reference voltage V
UVPH
.
The input of the PFC stage has some impedance that leads
to some sag of the input voltage when the input current is
large. If the PFC stage suddenly stops while a high current
is drawn from the mains, the abrupt decay of the current may
make the input voltage rise and the circuit detect a correct
line level. Instead, the gradual decrease of V
control
avoids a
line current discontinuity and limits the risk of false
triggering.
V
sns
internal voltage is also used to sense the line for
feed−forward. A similar method is used:
The V
sns
internal pin voltage is compared to a 1.801 V
reference.
If V
sns
exceeds 1.801 V, the circuit detects a high−line
condition and the loop gain is divided by three (the
internal PWM ramp slope is three times steeper)
Once this occurs, if V
sns
remains below 1.392 V for
25 ms, the circuit detects a low−line situation (500 mV
hysteresis).
At startup, the circuit is in High−line state (“LLINE” Low”)
and then V
sns
will be used to determine the High−Line or
Low−Line state.
The line range detection circuit allows more optimal loop
gain control for universal (wide input mains) applications.
NCP1622
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18
V
REF,LLINE
V
REF,BONOK
CSint VSNS
1.801 V if LLINE = 1
1.392 V otherwise
0.819 V if BONOK = 1
0.737 V otherwise
CSZCD
BUFFER
DEMAG
&
LINE SENSE
DRV
Figure 14. Input Line Sense Monitoring
CS/ZCD
LLINE
BONOK
Timer
25 ms
Timer
50 ms
Thermal Shut−Down (TSD)
An internal thermal circuitry disables the circuit gate drive
and keeps the power switch off when the junction
temperature exceeds 150°C. The output stage is then
enabled once the temperature drops below about 100°C
(50°C hysteresis).
The temperature shutdown remains active as long as the
circuit is not reset, that is, as long as V
CC
is higher than a reset
threshold.
Output Drive Section
The output stage contains a totem pole optimized to
minimize the cross conduction current during high
frequency operation. Its high current capability (−500 mA /
+800 mA) allows it to effectively drive high gate charge
power MOSFET.
Second Over−Voltage Protection
On top of the existing overvoltage protection, a second
and redundant overvoltage protection named OVP2 has
been added. This overvoltage protection, senses, during
t
DEMAG
the value of V
out
, thru the R
CS1
, R
CS2
divider bridge
connected to the pin CS and compares it to an OVP2 voltage
reference V
REF,OVP2
. Because it is not possible to adjust the
V
REF,OVP2
reference to R
fb1
& Rf
b2
that programs the V
out
value, it has been decided to set V
REF,OVP2
and R
CS1
, R
CS2
in order to get OVP2 triggering for Vout voltages much
higher than for OVP condition (e.g. OVP2 goes high when
Vout goes higher than 438 V)
For V
out
= 438 V for OVP2 and given a K
CS
value equal
to 1/138 (K
CS
=R
CS2
/(R
CS1
+R
CS2
), this gives
V
REF,OVP2
= 3.175 V for the threshold voltage to which is
compared to the CS voltage during t
off
. When V
CS
goes
above V
REF,OVP2
threshold of the OVP2 comparator
(100 mV hysteresis), and after a 1 ms leading edge blanking
time, the OVP2 flag is latched and will stop the switching by
resetting the main PWM latch. The OVP2 latch is reset each
800 ms.
OFF Mode
As previously mentioned, the circuit turns off when one
of the following faults is detected:
Incorrect feeding of the circuit (“UVLO” high when
V
CC
<V
CC(off)
, V
CC(off)
equating 9 V typically).
Excessive die temperature detected by the thermal
shutdown
Under−Voltage Protection
Brown−Out Fault and STATICOVP (see Figure 2)
Generally speaking, the circuit turns off when the
conditions are not proper for desired operation. In this mode,
the controller stops operating. The major part of the circuit
sleeps and its consumption is minimized.
More specifically, when the circuit is in OFF state:
The drive output is kept low
All the blocks are off except:
The UVLO circuitry that keeps monitoring the V
CC
voltage and controlling the start−up current source
accordingly
The TSD (thermal shutdown)
The Under−Voltage Protection (“UVP”)
The brown−out circuitry
V
ctrl
is grounded so that when the fault is removed, the
device starts−up under the soft start mode (version XB).
The internal “PFCOK” signal is grounded.
The output of the “V
ton
processing block” is grounded

NCP1622BECSNT1G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Power Factor Correction - PFC ENHANCED EFFICIENCY
Lifecycle:
New from this manufacturer.
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