BUK954R4-40B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 03 — 8 February 2011 3 of 14
NXP Semiconductors
BUK954R4-40B
N-channel TrenchMOS logic level FET
4. Limiting values
[1] Continuous current is limited by package.
[2] Current is limited by power dissipation chip rating.
[3] Continuous current is limited by package
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
DS
drain-source voltage T
j
25 °C; T
j
175 °C - 40 V
V
DGR
drain-gate voltage R
GS
=20k -40V
V
GS
gate-source voltage -15 15 V
I
D
drain current T
mb
=10C; V
GS
=5V; see Figure 1
[1]
-75A
T
mb
=2C; V
GS
=5V; see Figure 1;
see Figure 3
[2]
- 174 A
[1]
-75A
I
DM
peak drain current T
mb
= 25 °C; pulsed; t
p
10 µs;
see Figure 3
- 697 A
P
tot
total power dissipation T
mb
=2C; see Figure 2 - 254 W
T
stg
storage temperature -55 175 °C
T
j
junction temperature -55 175 °C
Source-drain diode
I
S
source current T
mb
=2C
[3]
-75A
[2]
- 174 A
I
SM
peak source current pulsed; t
p
10 µs; T
mb
= 25 °C - 697 A
Avalanche ruggedness
E
DS(AL)S
non-repetitive drain-source
avalanche energy
I
D
=75A; V
sup
40 V; R
GS
=50;
V
GS
=5V; T
j(init)
= 25 °C; unclamped
- 961 mJ
BUK954R4-40B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 03 — 8 February 2011 4 of 14
NXP Semiconductors
BUK954R4-40B
N-channel TrenchMOS logic level FET
Fig 1. Continuous drain current as a function of
mounting base temperature
Fig 2. Normalized total power dissipation as a
function of mounting base temperature
Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage
03nl58
V
DS
(V)
10
1
10
2
101
10
2
10
10
3
I
D
(A)
1
DC
100 ms
10 ms
Limit R
DSon
= V
DS
/ I
D
1 ms
t
p
= 10
μ
s
100
μ
s
Capped at 75 A due to package
BUK954R4-40B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 03 — 8 February 2011 5 of 14
NXP Semiconductors
BUK954R4-40B
N-channel TrenchMOS logic level FET
5. Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-mb)
thermal resistance from
junction to mounting base
see Figure 4 --0.59K/W
R
th(j-a)
thermal resistance from
junction to ambient
vertical in still air - 60 - K/W
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration
03nl59
t
p
(s)
10
6
10
1
110
2
10
3
10
5
10
4
10
1
10
2
1
Z
th(j-mb)
(K/W)
10
3
single shot
0.2
0.1
0.05
0.02
δ = 0.5
t
p
t
p
T
P
t
T
δ =

BUK954R4-40B,127

Mfr. #:
Manufacturer:
Nexperia
Description:
RF Bipolar Transistors MOSFET HIGH PERF TRENCHMOS
Lifecycle:
New from this manufacturer.
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